Chipbond Technology

Chipbond Technology Receivables

The Accounts Receivable of Chipbond Technology (6147.TWO) as of Oct 30, 2026 is 4.14 B TWD. In the previous year, Accounts Receivable was 4.02 B TWD — a change of 2.85% (higher).

Receivables

4.14 BTWD

YoY

2.85%

Last updated:

Accounts Receivable of Chipbond Technology is 2024 4.14 B TWD. Accounts Receivable of Chipbond Technology was 2023 4.02 B TWD. It decreases by 2.85% higher compared to the previous year.

The Chipbond Technology Receivables history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Receivables
Date
Receivables
Jan 1, 2017
4.52 B TWD
Jan 1, 2018
5.66 B TWD
Jan 1, 2019
4.07 B TWD
Jan 1, 2020
4.70 B TWD
Jan 1, 2021
6.25 B TWD
Jan 1, 2022
4.60 B TWD
Jan 1, 2023
4.02 B TWD
Jan 1, 2024
4.14 B TWD
The Chipbond Technology Receivables history
YEARReceivablesYoY
4.14 BTWD+2.85%
4.02 BTWD-12.53%
4.60 BTWD-26.40%
6.25 BTWD+33.02%
4.70 BTWD+15.32%
4.07 BTWD-28.08%
5.66 BTWD+25.40%
4.52 BTWD+0.12%
4.51 BTWD+21.45%
3.71 BTWD-22.71%
4.81 BTWD—

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Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology Corp. generates revenue through the manufacturing and distribution of driver integrated circuits, including gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip, and tape carrier packaging (TCP) products. Its primary customers are manufacturers of computers, workstations, mobile phones, network products, automotive components such as air bag controllers, engine controlling components, automatic brake systems (ABSs), and automobile air conditioners, as well as producers of LCD monitors, digital cameras, and watches. The company focuses its sales in Taiwan, the United States of America, and other global regions, with products serving both consumer electronics and automotive industries. The firm's product portfolio targets key segments including consumer electronics, automotive systems, and display technologies, where its packaging solutions are integral to device assembly. By supplying specialized components like COG and TCP, Chipbond supports the production of high-demand devices across multiple sectors, ensuring steady demand from established industry players. Distribution channels emphasize direct sales to original equipment manufacturers (OEMs) and technology firms in target markets. Chipbond Technology is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Chipbond Technology stock

Accounts Receivable of Chipbond Technology is 4.14 B TWD in 2024.

Accounts Receivable of Chipbond Technology changed from 4.02 B TWD to 4.14 B TWD, representing a 2.85% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Accounts Receivable Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.

Receivables represent money owed to the company by customers for goods or services delivered. High receivables relative to revenue may indicate collection issues.

Accounts Receivable's TWD is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track Accounts Receivable's Chipbond Technology historically and in real time.

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Balance Sheet — Chipbond Technology

All Key Metrics — Chipbond Technology