Chipbond Technology

Chipbond Technology Net Debt/FCF

The Net Debt to Free Cash Flow Ratio of Chipbond Technology (6147.TWO) as of Nov 4, 2026 is -0.81. In the previous year, Net Debt to Free Cash Flow Ratio was 0.09 — a change of -1,012.95% (lower).

Net Debt/FCF

-0.81

YoY

-1,012.95%

Last updated:

Net Debt to Free Cash Flow Ratio of Chipbond Technology is 2025 -0.81 . Net Debt to Free Cash Flow Ratio of Chipbond Technology was 2024 0.09 . It decreases by -1,012.95% lower compared to the previous year.

The Chipbond Technology Net Debt/FCF history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Net Debt/FCF
Date
Net Debt/FCF
Jan 1, 2018
3.96 TWD
Jan 1, 2019
-0.66 TWD
Jan 1, 2020
0.22 TWD
Jan 1, 2021
0.11 TWD
Jan 1, 2022
-0.36 TWD
Jan 1, 2023
-0.98 TWD
Jan 1, 2024
0.09 TWD
Jan 1, 2025
-0.81 TWD
The Chipbond Technology Net Debt/FCF history
YEARNet Debt/FCFYoY
-0.81-1,012.95%
0.09-108.98%
-0.98+172.78%
-0.36-416.01%
0.11-47.46%
0.22-132.69%
-0.66-116.75%
3.96-1,140.72%
-0.38+294.63%
-0.10-102.33%
4.14+179.45%
1.48—

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Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology Corp. generates revenue through the manufacturing and distribution of driver integrated circuits, including gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip, and tape carrier packaging (TCP) products. Its primary customers are manufacturers of computers, workstations, mobile phones, network products, automotive components such as air bag controllers, engine controlling components, automatic brake systems (ABSs), and automobile air conditioners, as well as producers of LCD monitors, digital cameras, and watches. The company focuses its sales in Taiwan, the United States of America, and other global regions, with products serving both consumer electronics and automotive industries. The firm's product portfolio targets key segments including consumer electronics, automotive systems, and display technologies, where its packaging solutions are integral to device assembly. By supplying specialized components like COG and TCP, Chipbond supports the production of high-demand devices across multiple sectors, ensuring steady demand from established industry players. Distribution channels emphasize direct sales to original equipment manufacturers (OEMs) and technology firms in target markets. Chipbond Technology is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Chipbond Technology stock

Net Debt to Free Cash Flow Ratio of Chipbond Technology is -0.81 in 2025.

Net Debt to Free Cash Flow Ratio of Chipbond Technology changed from 0.09 to -0.81, representing a -1,012.95% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of Net Debt to Free Cash Flow Ratio Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.

Net Debt/FCF indicates how many years it would take to repay net debt using free cash flow. Lower ratios suggest faster deleveraging potential.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Net Debt to Free Cash Flow Ratio's Chipbond Technology with sector peers and the industry average to assess whether it is attractive.

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Leverage — Chipbond Technology

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