Chipbond Technology

Chipbond Technology Financial Leverage

The Financial Leverage (Equity Multiplier) of Chipbond Technology (6147.TWO) as of Oct 15, 2026 is 1.14. In the previous year, Financial Leverage (Equity Multiplier) was 1.10 — a change of 3.72% (higher).

Financial Leverage

1.14

YoY

3.72%

Last updated:

Financial Leverage (Equity Multiplier) of Chipbond Technology is 2025 1.14 . Financial Leverage (Equity Multiplier) of Chipbond Technology was 2024 1.10 . It decreases by 3.72% higher compared to the previous year.

The Chipbond Technology Financial Leverage history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Financial Leverage
Date
Financial Leverage
Jan 1, 2018
1.42 TWD
Jan 1, 2019
1.35 TWD
Jan 1, 2020
1.35 TWD
Jan 1, 2021
1.29 TWD
Jan 1, 2022
1.25 TWD
Jan 1, 2023
1.12 TWD
Jan 1, 2024
1.10 TWD
Jan 1, 2025
1.14 TWD
The Chipbond Technology Financial Leverage history
YEARFinancial LeverageYoY
1.14+3.72%
1.10-1.86%
1.12-9.75%
1.25-3.47%
1.29-4.41%
1.35-0.30%
1.35-4.68%
1.42-1.69%
1.45-0.40%
1.45-11.59%
1.64-5.15%
1.73—

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Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology Corp, listed on the Taiwan Stock Exchange under ticker 6147.TWO with ISIN TW0006147002, is a semiconductor company headquartered in Hsinchu, Taiwan. Founded in 2002, the company went public on January 2, 2002. Chipbond specializes in the manufacturing of driver integrated circuits and offers a range of packaging solutions including gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip, and tape carrier packaging (TCP). These products are utilized across various industries, particularly in the production of computers, workstations, mobile phones, network devices, automotive components such as air bag controllers, engine control modules, anti-lock braking systems (ABS), and automotive air conditioning systems, as well as in digital cameras, watches, and liquid crystal display (LCD) monitors. The company distributes its products primarily within Taiwan, the United States, and other global markets. Chipbond operates within the Information Technology sector, focusing on semiconductor technology and related applications. Its business model centers on providing specialized packaging and integration solutions for electronic components, supporting a diverse array of consumer and industrial electronics. The company's website is https://www.chipbond.com.tw/. Chipbond Technology is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Chipbond Technology stock

Financial Leverage (Equity Multiplier) of Chipbond Technology is 1.14 in 2025.

Financial Leverage (Equity Multiplier) of Chipbond Technology changed from 1.10 to 1.14, representing a 3.72% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Financial Leverage (Equity Multiplier) Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.

Financial leverage, also known as the equity multiplier, measures total assets relative to equity. Higher leverage amplifies both returns and risks.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Financial Leverage (Equity Multiplier)'s Chipbond Technology with sector peers and the industry average to assess whether it is attractive.

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Leverage — Chipbond Technology

Debt-to-EquityNet Debt / EBITDAInterest CoverageCurrent RatioQuick RatioCash RatioDebt / AssetsFinancial LeverageEquity RatioLT Debt/EquityNet Debt/EquityDebt/EBITDADSCRFinancial Debt RatioOCF/DebtFCF/DebtNet Debt/FCFDebt/Market Cap

All Key Metrics — Chipbond Technology