Chipbond Technology

Chipbond Technology Debt

The Debt of Chipbond Technology (6147.TWO) as of Oct 16, 2026 is 1.26 B TWD. In the previous year, Debt was 388.12 M TWD — a change of 223.92% (higher).

Debt

1.26 BTWD

YoY

223.92%

Last updated:

In 2025, Chipbond Technology's total debt was 1.26 B TWD, a 223.92% change from the 388.12 M TWD total debt recorded in the previous year.

The Chipbond Technology Debt history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Debt
Date
Debt
Jan 1, 2018
4.43 B TWD
Jan 1, 2019
4.96 B TWD
Jan 1, 2020
4.98 B TWD
Jan 1, 2021
5.93 B TWD
Jan 1, 2022
3.44 B TWD
Jan 1, 2023
1.31 B TWD
Jan 1, 2024
388.12 M TWD
Jan 1, 2025
1.26 B TWD
The Chipbond Technology Debt history
YEARDebtYoY
1.26 BTWD+223.92%
388.12 MTWD-70.43%
1.31 BTWD-61.81%
3.44 BTWD-42.02%
5.93 BTWD+19.11%
4.98 BTWD+0.37%
4.96 BTWD+12.01%
4.43 BTWD-13.58%
5.12 BTWD-13.82%
5.94 BTWD-43.69%
10.55 BTWD-13.22%
12.16 BTWD—

Access this data via the Eulerpool API

100,000 free requests/mo · no credit card

Get Free API Key

Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology Corp, listed on the Taiwan Stock Exchange under ticker 6147.TWO with ISIN TW0006147002, is a semiconductor company headquartered in Hsinchu, Taiwan. Founded in 2002, the company went public on January 2, 2002. Chipbond specializes in the manufacturing of driver integrated circuits and offers a range of packaging solutions including gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip, and tape carrier packaging (TCP). These products are utilized across various industries, particularly in the production of computers, workstations, mobile phones, network devices, automotive components such as air bag controllers, engine control modules, anti-lock braking systems (ABS), and automotive air conditioning systems, as well as in digital cameras, watches, and liquid crystal display (LCD) monitors. The company distributes its products primarily within Taiwan, the United States, and other global markets. Chipbond operates within the Information Technology sector, focusing on semiconductor technology and related applications. Its business model centers on providing specialized packaging and integration solutions for electronic components, supporting a diverse array of consumer and industrial electronics. The company's website is https://www.chipbond.com.tw/. Chipbond Technology is one of the most popular companies on Eulerpool.

Debt Details

Understanding Chipbond Technology's Debt Structure

Chipbond Technology's total debt refers to the cumulative financial obligations the company owes to external parties. This can include short-term and long-term borrowings, bonds, loans, and other financial instruments. Assessing the company's debt levels is crucial for evaluating its financial health, risk profile, and ability to fund operations and expansions.

Year-to-Year Comparison

Analyzing Chipbond Technology's debt structure over the years provides insights into the firm’s financial strategy and stability. A reduction in debt can indicate financial strength and operational efficiency, while an increase may signal growth investments or potential financial challenges ahead.

Impact on Investments

Investors pay close attention to Chipbond Technology’s debt levels as they can influence the company’s risk and return profiles. Excessive debt can lead to financial strain, while moderate and well-managed debt can be a catalyst for growth and expansion, making it a critical aspect of investment evaluations.

Interpreting Debt Fluctuations

Shifts in Chipbond Technology’s debt levels can be attributed to various operational and strategic factors. An increase in debt might be geared towards funding expansion projects or enhancing operational capacity, while a decrease may indicate profit realizations or an approach to minimize financial risk and leverage.

Frequently Asked Questions about Chipbond Technology stock

Debt of Chipbond Technology is 1.26 B TWD in 2025.

Debt of Chipbond Technology changed from 388.12 M TWD to 1.26 B TWD, representing a 223.92% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Debt Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.

Debt's TWD is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track Debt's Chipbond Technology historically and in real time.

Access this data via the Eulerpool API

100,000 free requests/mo · no credit card

Get Free API Key

Balance Sheet — Chipbond Technology

Total AssetsCurrent AssetsCash & EquivalentsReceivablesInventoryProperty, Plant & EquipmentGoodwillIntangible AssetsEquityLiabilitiesDebtCurrent LiabilitiesLong-term DebtShort-term DebtRetained EarningsBook Value per ShareTangible Book Value per ShareWorking CapitalInvestmentsAccounts PayableNon-Current AssetsShort-Term InvestmentsLong-Term InvestmentsNet DebtTreasury StockMinority InterestDeferred Tax LiabilitiesNet Tangible AssetsGoodwill/AssetsIntangibles/Assets

All Key Metrics — Chipbond Technology