Chipbond Technology

Chipbond Technology Dividend Yield

The Dividend Yield of Chipbond Technology (6147.TWO) as of Oct 17, 2026 is 7.17 %. In the previous year, Dividend Yield was 7.17 % — a change of 0.01% (higher).

Dividend Yield

7.17 %

YoY

0.01%

Last updated:

Dividend Yield of Chipbond Technology is 2025 7.17 % . Dividend Yield of Chipbond Technology was 2024 7.17 % . It decreases by 0.01% higher compared to the previous year.

The Chipbond Technology Dividend Yield history

  • 3 Years

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  • 25 Years

  • Max

Dividend Yield
Date
Dividend Yield
Jan 1, 2022
11.46 TWD
Jan 1, 2023
10.51 TWD
Jan 1, 2024
7.17 TWD
Jan 1, 2025
7.17 TWD
The Chipbond Technology Dividend Yield history
YEARDividend YieldYoY
7.17 %+0.01%
7.17 %-31.82%
10.51 %-8.33%
11.46 %—

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Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology Corp, listed on the Taiwan Stock Exchange under ticker 6147.TWO with ISIN TW0006147002, is a semiconductor company headquartered in Hsinchu, Taiwan. Founded in 2002, the company went public on January 2, 2002. Chipbond specializes in the manufacturing of driver integrated circuits and offers a range of packaging solutions including gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip, and tape carrier packaging (TCP). These products are utilized across various industries, particularly in the production of computers, workstations, mobile phones, network devices, automotive components such as air bag controllers, engine control modules, anti-lock braking systems (ABS), and automotive air conditioning systems, as well as in digital cameras, watches, and liquid crystal display (LCD) monitors. The company distributes its products primarily within Taiwan, the United States, and other global markets. Chipbond operates within the Information Technology sector, focusing on semiconductor technology and related applications. Its business model centers on providing specialized packaging and integration solutions for electronic components, supporting a diverse array of consumer and industrial electronics. The company's website is https://www.chipbond.com.tw/. Chipbond Technology is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Chipbond Technology stock

Dividend Yield of Chipbond Technology is 7.17 % in 2025.

Dividend Yield of Chipbond Technology changed from 7.17 % to 7.17 %, representing a 0.01% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Dividend Yield Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.

Dividend yield measures the annual dividend payment relative to the stock price. It shows the return an investor receives from dividends alone.

Dividend Yield's is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track Dividend Yield's Chipbond Technology historically and in real time.

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