Chipbond Technology Stock

Chipbond Technology Current Liabilities

The Current Liabilities of Chipbond Technology (6147.TWO) as of Jul 30, 2026 is 929.83 M TWD. In the previous year, Current Liabilities was 2.64 B TWD — a change of -64.80% (lower).

Current Liabilities

929.83 MTWD

YoY

-64.80%

Last updated:

Current Liabilities of Chipbond Technology is 2026 929.83 M TWD. Current Liabilities of Chipbond Technology was 2025 2.64 B TWD. It decreases by -64.80% lower compared to the previous year.
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Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Chipbond Technology stock

Current Liabilities of Chipbond Technology is 929.83 M TWD in 2026.

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Balance Sheet — Chipbond Technology

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