Chipbond Technology Liabilities
The The Liabilities of Chipbond Technology (6147.TWO) as of Oct 15, 2026 is 6.86 B TWD. In the previous year, The Liabilities was 4.89 B TWD — a change of 40.33% (higher).
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Liabilities
6.86 BTWD
YoY
40.33%
Last updated:
In 2025, Chipbond Technology's total liabilities amounted to 6.86 B TWD, a 40.33% difference from the 4.89 B TWD total liabilities in the previous year.
The Chipbond Technology Liabilities history
3 Years
10 Years
25 Years
Max
| YEAR | Liabilities | YoY |
|---|---|---|
| 6.86 BTWD | +40.33% | |
| 4.89 BTWD | -19.13% | |
| 6.05 BTWD | -39.94% | |
| 10.07 BTWD | -16.97% | |
| 12.12 BTWD | +7.97% | |
| 11.23 BTWD | +6.67% | |
| 10.53 BTWD | -10.30% | |
| 11.74 BTWD | +16.68% | |
| 10.06 BTWD | +1.87% | |
| 9.87 BTWD | -30.64% | |
| 14.24 BTWD | -11.74% | |
| 16.13 BTWD | — |
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Chipbond Technology Stock analysis
Liabilities Details
Assessing Chipbond Technology's Liabilities
Chipbond Technology's liabilities constitute the company's financial obligations and debts owed to external parties and stakeholders. They are categorized into current liabilities, due within a year, and long-term liabilities, which are due over a longer period. A detailed assessment of these liabilities is crucial for evaluating Chipbond Technology's financial stability, operational efficiency, and long-term viability.
Year-to-Year Comparison
By comparing Chipbond Technology's liabilities year-over-year, investors can identify trends, shifts, and anomalies in the company’s financial positioning. A decrease in total liabilities often signals financial strengthening, while an increase might indicate enhanced investments, acquisitions, or potential financial strain.
Impact on Investments
Chipbond Technology's total liabilities play a significant role in determining the company's leverage and risk profile. Investors and analysts examine this aspect meticulously to ascertain the firm’s ability to meet its financial obligations, which influences investment attractiveness and credit ratings.
Interpreting Liability Fluctuations
Shifts in Chipbond Technology’s liability structure indicate changes in its financial management and strategy. A reduction in liabilities reflects efficient financial management or debt payoffs, while an increase may suggest expansion, acquisition activities, or accruing operational expenses, each carrying distinct implications for investors.
Frequently Asked Questions about Chipbond Technology stock
The Liabilities of Chipbond Technology is 6.86 B TWD in 2025.
The Liabilities of Chipbond Technology changed from 4.89 B TWD to 6.86 B TWD, representing a 40.33% change. The value is higher than the previous year.
On Eulerpool you can find the complete historical development of The Liabilities Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.
The Liabilities's TWD is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track The Liabilities's Chipbond Technology historically and in real time.
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Balance Sheet — Chipbond Technology
All Key Metrics — Chipbond Technology
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