Chipbond Technology Stock

Chipbond Technology Liabilities

The The Liabilities of Chipbond Technology (6147.TWO) as of Aug 16, 2026 is 6.86 B TWD. In the previous year, The Liabilities was 4.89 B TWD — a change of 40.33% (higher).

Liabilities

6.86 BTWD

YoY

40.33%

Last updated:

In 2026, Chipbond Technology's total liabilities amounted to 6.86 B TWD, a 40.33% difference from the 4.89 B TWD total liabilities in the previous year.

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Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology is one of the most popular companies on Eulerpool.

Liabilities Details

Assessing Chipbond Technology's Liabilities

Chipbond Technology's liabilities constitute the company's financial obligations and debts owed to external parties and stakeholders. They are categorized into current liabilities, due within a year, and long-term liabilities, which are due over a longer period. A detailed assessment of these liabilities is crucial for evaluating Chipbond Technology's financial stability, operational efficiency, and long-term viability.

Year-to-Year Comparison

By comparing Chipbond Technology's liabilities year-over-year, investors can identify trends, shifts, and anomalies in the company’s financial positioning. A decrease in total liabilities often signals financial strengthening, while an increase might indicate enhanced investments, acquisitions, or potential financial strain.

Impact on Investments

Chipbond Technology's total liabilities play a significant role in determining the company's leverage and risk profile. Investors and analysts examine this aspect meticulously to ascertain the firm’s ability to meet its financial obligations, which influences investment attractiveness and credit ratings.

Interpreting Liability Fluctuations

Shifts in Chipbond Technology’s liability structure indicate changes in its financial management and strategy. A reduction in liabilities reflects efficient financial management or debt payoffs, while an increase may suggest expansion, acquisition activities, or accruing operational expenses, each carrying distinct implications for investors.

Frequently Asked Questions about Chipbond Technology stock

The Liabilities of Chipbond Technology is 6.86 B TWD in 2026.

The Liabilities of Chipbond Technology changed from 4.89 B TWD to 6.86 B TWD, representing a 40.33% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of The Liabilities Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.

The Liabilities's TWD is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track The Liabilities's Chipbond Technology historically and in real time.

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Balance Sheet — Chipbond Technology

Total AssetsCurrent AssetsCash & EquivalentsReceivablesInventoryProperty, Plant & EquipmentGoodwillIntangible AssetsEquityLiabilitiesDebtCurrent LiabilitiesLong-term DebtShort-term DebtRetained EarningsBook Value per ShareTangible Book Value per ShareWorking CapitalInvestmentsAccounts PayableNon-Current AssetsShort-Term InvestmentsLong-Term InvestmentsNet DebtTreasury StockMinority InterestDeferred Tax LiabilitiesNet Tangible AssetsGoodwill/AssetsIntangibles/Assets

All Key Metrics — Chipbond Technology