Chipbond Technology

Chipbond Technology Net Debt per Share

The Net Debt per Share of Chipbond Technology (6147.TWO) as of Oct 26, 2026 is 1.67 TWD. In the previous year, Net Debt per Share was 0.52 TWD — a change of 223.92% (higher).

Net Debt per Share

1.67TWD

YoY

223.92%

Last updated:

Net Debt per Share of Chipbond Technology is 2025 1.67 TWD. Net Debt per Share of Chipbond Technology was 2024 0.52 TWD. It decreases by 223.92% higher compared to the previous year.

The Chipbond Technology Net Debt per Share history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Net Debt per Share
Date
Net Debt per Share
Jan 1, 2018
-2.17 TWD
Jan 1, 2019
-2.90 TWD
Jan 1, 2020
1.03 TWD
Jan 1, 2021
0.47 TWD
Jan 1, 2022
-3.22 TWD
Jan 1, 2023
-5.74 TWD
Jan 1, 2024
0.52 TWD
Jan 1, 2025
1.67 TWD
The Chipbond Technology Net Debt per Share history
YEARNet Debt per ShareYoY
1.67TWD+223.92%
0.52TWD-108.99%
-5.74TWD+78.31%
-3.22TWD-786.38%
0.47TWD-54.49%
1.03TWD-135.56%
-2.90TWD+33.58%
-2.17TWD+72.34%
-1.26TWD+452.17%
-0.23TWD-103.63%
6.27TWD-21.78%
8.02TWD—

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Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology Corp. generates revenue through the manufacturing and distribution of driver integrated circuits, including gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip, and tape carrier packaging (TCP) products. Its primary customers are manufacturers of computers, workstations, mobile phones, network products, automotive components such as air bag controllers, engine controlling components, automatic brake systems (ABSs), and automobile air conditioners, as well as producers of LCD monitors, digital cameras, and watches. The company focuses its sales in Taiwan, the United States of America, and other global regions, with products serving both consumer electronics and automotive industries. The firm's product portfolio targets key segments including consumer electronics, automotive systems, and display technologies, where its packaging solutions are integral to device assembly. By supplying specialized components like COG and TCP, Chipbond supports the production of high-demand devices across multiple sectors, ensuring steady demand from established industry players. Distribution channels emphasize direct sales to original equipment manufacturers (OEMs) and technology firms in target markets. Chipbond Technology is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Chipbond Technology stock

Net Debt per Share of Chipbond Technology is 1.67 TWD in 2025.

Net Debt per Share of Chipbond Technology changed from 0.52 TWD to 1.67 TWD, representing a 223.92% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Net Debt per Share Chipbond Technology since 2006 – with annual values, charts, and detailed analysis.

Net debt per share divides net debt by shares outstanding, showing the debt burden attributable to each share after accounting for cash reserves.

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