Chipbond Technology

Chipbond Technology Dividend

The Dividend of Chipbond Technology (6147.TWO) as of Nov 4, 2026 is 3.75 TWD. In the previous year, Dividend was 3.75 TWD — a change of 0.01% (higher).

Dividend

3.75TWD

YoY

0.01%

Dividend yield

1.96 %

Last updated:

How much dividend does Chipbond Technology 2026 pay?

According to the latest status from November 2026, Chipbond Technology paid a total of 3.75 TWD per share in dividends within the last 12 months. With the current Chipbond Technology price of 191.50 TWD, this corresponds to a dividend yield of 1.96 %. A dividend is paid times per year.

At today's price the dividend yield works out to roughly 1.96%. The payout ratio is around 101% of earnings.

Historical Chipbond Technology Dividends

A dividend is paid times per year. Last year, the payout months were and July.

Historical Chipbond Technology Dividends
PaydateDividend
2.80TWD
3.75TWD
3.75TWD
5.50TWD
6.00TWD

The Chipbond Technology Dividend history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Dividend
Date
Dividend
Jan 1, 2021
0.00 TWD
Jan 1, 2022
6.00 TWD
Jan 1, 2023
5.50 TWD
Jan 1, 2024
3.75 TWD
Jan 1, 2025
3.75 TWD
Jan 1, 2026 (e)
2.80 TWD
Jan 1, 2027 (e)
2.80 TWD
Jan 1, 2028 (e)
2.80 TWD
The Chipbond Technology Dividend history
YEARDividendYoY
est2.80TWD0.00%
est2.80TWD0.00%
est2.80TWD-25.34%
3.75TWD+0.01%
3.75TWD-31.82%
5.50TWD-8.33%
6.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—
0.00TWD—

Chipbond Technology dividend history and estimates

In 2025, Chipbond Technology paid a dividend amounting to 3.75 TWD. Dividend means that Chipbond Technology distributes a portion of its profits to its owners.

  • 3 Years

  • 5 Years

  • 10 Years

  • 25 Years

  • Max

Dividend
Details
Date
Dividend
Dividend (Estimate)
Jan 1, 2022
6.00 TWD
0.00 TWD
Jan 1, 2023
5.50 TWD
0.00 TWD
Jan 1, 2024
3.75 TWD
0.00 TWD
Jan 1, 2025
3.75 TWD
0.00 TWD
Jan 1, 2026
2.80 TWD
0.00 TWD
Jan 1, 2027 (e)
0.00 TWD
2.80 TWD
Jan 1, 2028 (e)
0.00 TWD
2.80 TWD

Is the Chipbond Technology Dividend Safe?

Chipbond Technology has been increasing the dividend for 1 years.

Analysts expect a Dividend Cut of -13.59% for the current fiscal year.

Chipbond Technology dividend payout ratio

In 2025, Chipbond Technology had a payout ratio of 100.61%. The payout ratio indicates the percentage of the company's profits that Chipbond Technology distributes as dividends.

  • 3 Years

  • 5 Years

  • 10 Years

  • 25 Years

  • Max

Payout ratio
Details
Date
Payout ratio
Jan 1, 2021
90.64 %
Jan 1, 2022
72.97 %
Jan 1, 2023
103.79 %
Jan 1, 2024
67.50 %
Jan 1, 2025
100.61 %
Jan 1, 2026 (e)
48.64 %
Jan 1, 2027 (e)
30.25 %
Jan 1, 2028 (e)
25.88 %

Dividend Details

Understanding Chipbond Technology's Dividend Distributions

Chipbond Technology’s dividends are a portion of the company’s profits distributed to shareholders. It is a critical indicator of the company’s financial health and attractiveness to investors. Dividends provide investors with a steady income stream, in addition to any profits that may come from selling the stock at a higher price than the purchase price.

Year-to-Year Comparison

Examining Chipbond Technology's dividend distributions over the years can highlight the company’s profitability and stability. A consistent or increasing dividend payout can indicate a financially healthy company with predictable earnings, while fluctuations or reductions in dividends can suggest underlying financial or operational challenges.

Impact on Investments

Chipbond Technology's dividend payments are an essential factor for income-focused investors. A robust dividend payout can enhance the stock’s appeal, offering regular income in addition to potential capital gains. It also can indicate the company's confidence in its future earnings, making it a significant consideration in investment decisions.

Interpreting Dividend Fluctuations

Changes in Chipbond Technology’s dividends can result from shifts in the company’s earnings, financial policies, or reinvestment strategies. An increase in dividends often signals financial stability, while a decrease may indicate a need to conserve cash or reinvest profits to fuel growth, each scenario having different implications for investors.

Chipbond Technology Stock analysis

What does Chipbond Technology do? Chipbond Technology Corp. generates revenue through the manufacturing and distribution of driver integrated circuits, including gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip, and tape carrier packaging (TCP) products. Its primary customers are manufacturers of computers, workstations, mobile phones, network products, automotive components such as air bag controllers, engine controlling components, automatic brake systems (ABSs), and automobile air conditioners, as well as producers of LCD monitors, digital cameras, and watches. The company focuses its sales in Taiwan, the United States of America, and other global regions, with products serving both consumer electronics and automotive industries. The firm's product portfolio targets key segments including consumer electronics, automotive systems, and display technologies, where its packaging solutions are integral to device assembly. By supplying specialized components like COG and TCP, Chipbond supports the production of high-demand devices across multiple sectors, ensuring steady demand from established industry players. Distribution channels emphasize direct sales to original equipment manufacturers (OEMs) and technology firms in target markets. Chipbond Technology is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Chipbond Technology stock

Over the past 12 months, Chipbond Technology paid a dividend of 3.75 TWD . This corresponds to a dividend yield of about 1.96 %. For the coming 12 months, Chipbond Technology is expected to pay a dividend of 2.80 TWD.

The current dividend yield of Chipbond Technology is 1.96 %.

Chipbond Technology pays a dividend, distributed in the months of June, May.

Chipbond Technology paid dividends every year for the past 4 years.

For the upcoming 12 months, dividends amounting to 2.80 TWD are expected. This corresponds to a dividend yield of 1.46 %.

Chipbond Technology is assigned to the 'Information technology' sector.

In the year 2025, Chipbond Technology distributed 3.75 TWD as dividends.

The dividends of Chipbond Technology are distributed in TWD.

Dividend calendar 2026

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