Amkor Technology Inc represents a strong commitment to providing advanced semiconductor packaging and test services. With a corporate philosophy focused on innovation, quality, and customer satisfaction, Amkor strives to be a global leader in the industry. The company values collaboration and partnerships to drive technological advancements and deliver cutting-edge solutions to their customers. Amkor Technology Inc aims to create value for their stakeholders by continuously improving their operations, investing in research and development, and maintaining a customer-centric approach. Through their dedication to excellence and unwavering integrity, Amkor Technology Inc sets high standards in the market.

Amkor Technology Inc is primarily present in several countries and regions worldwide. These include the United States, South Korea, China, Japan, Taiwan, and the Philippines.

Amkor Technology Inc has achieved several significant milestones throughout its history. One notable achievement was the company's establishment in 1968, marking its entry into the semiconductor industry. Over the years, Amkor has become a leading provider of advanced packaging solutions, catering to diverse sectors such as automotive, mobile communications, and consumer electronics. The company's innovative technologies, such as its advanced assembly and test technologies, have revolutionized the industry. Additionally, Amkor has expanded its global footprint with manufacturing facilities in various countries, solidifying its position as a trusted partner for semiconductor companies worldwide. Overall, Amkor Technology Inc has successfully carved a prestigious path with its continuous growth and commitment to delivering cutting-edge packaging solutions.

Amkor Technology Inc. is a leading provider of outsourced semiconductor packaging and test services. Established in 1968, the company has a rich history in the semiconductor industry. Amkor Technology Inc. started as a subsidiary of American Nucleonics Corporation, specializing in nuclear power technology. However, it shifted its focus to semiconductor packaging in the late 1980s. Since then, the company has expanded its operations globally and has become a trusted partner for many semiconductor companies worldwide. Amkor Technology Inc. offers a wide range of packaging and testing solutions to cater to the evolving needs of the industry, ensuring high-quality and reliable semiconductor products.

The main competitors of Amkor Technology Inc in the market are Advanced Semiconductor Engineering Inc (ASE), Siliconware Precision Industries Co., Ltd (SPIL), and Stats ChipPAC Ltd.

Amkor Technology Inc is primarily active in the semiconductor and electronics manufacturing industries.

The business model of Amkor Technology Inc. revolves around providing outsourced semiconductor packaging and test services. As a leading provider in the industry, Amkor partners with various companies, including integrated device manufacturers, fabless semiconductor companies, and original equipment manufacturers. The company's services include wafer probe, assembly, final testing, and packaging of integrated circuits. By offering a comprehensive range of services, Amkor enables its clients to achieve cost efficiency, reduce time to market, and focus on their core competencies. With its expertise in advanced packaging technologies, Amkor Technology Inc. strives to drive innovation and deliver high-quality solutions to meet the evolving demands of the semiconductor industry.

Rasio P/E Amkor Technology adalah 21,05.

Rasio KUV dari Amkor Technology adalah 1,41.

Skor Kualitas AlleAktien untuk Amkor Technology adalah 6/10.

Omset diharapkan Amkor Technology adalah 6,67 miliar USD.

Laba diharapkan Amkor Technology adalah 447,95 Juta. USD.

Amkor Technology Inc is a leading provider of advanced semiconductor packaging and testing services. The company offers a wide range of products and services that cover both the development and manufacturing of semiconductor devices. Key services include systems design, prototyping, production, testing, packaging, and wafer processing. The Advanced Packagings and Services (APS) division specializes in the development, design, and manufacturing of advanced semiconductor packages that enable higher performance, smaller size, and more efficient integration. These include three-dimensional chip stacks, multi-chip modules (MCMs), and chip-on-board (COB) solutions. The division also offers custom packaging designs, as well as a variety of processes and materials to enhance semiconductor performance. The Test Services (TS) division offers a wide range of development, testing, analysis, and verification services for semiconductor systems. Customers include both original equipment manufacturers (OEMs) and electronic component manufacturers. Services include test facility design, test program creation, functional testing, and semiconductor sorting and packaging. Both APS and TS offer a broad portfolio of standard products and custom solutions tailored to the specific requirements of customers. The company is also capable of providing a complete process chain, from semiconductor manufacturing to final packaging and sorting, enabling customers to accelerate their product development and shorten their time-to-market. Amkor Technology Inc is also capable of offering a wide range of custom services, such as module and component integration into system solutions. This includes system design and prototype development, component integration, and system-level manufacturing. The company is also able to provide a wide range of materials and processes tailored to the needs of customers. These include special packaging materials, such as plastic and ceramic substrates, as well as special processing technologies, such as wafer level packaging (WLP) or molded interconnect device (MID). Overall, Amkor Technology Inc offers a broad portfolio of products and services that enable customers to accelerate their product development and shorten their time-to-market. The company is also able to offer custom solutions tailored to the specific requirements of customers. With its comprehensive expertise in semiconductor design, manufacturing, and packaging, Amkor Technology Inc is a preferred partner for leading companies in the semiconductor industry.

Amkor Technology membayarkan dividen sebesar 0,23 USD yang dibagi melalui 4 pembayaran dalam setahun.

Amkor Technology membagikan dividen sebanyak 4 kali dalam setahun.

ISIN dari Amkor Technology adalah US0316521006.

WKN dari Amkor Technology adalah 911648.

Ticker dari Amkor Technology adalah AMKR.

Dalam 12 bulan terakhir, Amkor Technology membayar dividen sebesar 0,30 USD . Ini setara dengan yield dividen sekitar 0,80 %. Untuk 12 bulan mendatang, Amkor Technology diperkirakan akan membayar dividen sebesar 0,36 USD.

Imbal hasil dividen dari Amkor Technology saat ini adalah 0,80 %.

Amkor Technology membayar dividen setiap kuartal. Dividen ini dibayarkan pada bulan Oktober, Januari, April, Juli.

Amkor Technology membayar dividen setiap tahun dalam 7 tahun terakhir.

Untuk 12 bulan ke depan, diperkirakan akan ada dividen sebesar 0,36 USD. Ini setara dengan yield dividen sebesar 0,95 %.

Amkor Technology dikelompokkan dalam sektor 'Teknologi Informasi'.

Untuk menerima dividen terakhir dari Amkor Technology tanggal 24/6/2024 sejumlah 0,079 USD, Anda harus memiliki saham tersebut di portofolio sebelum tanggal Ex-Tag pada 4/6/2024.

Pembayaran dividen terakhir dilakukan pada 24/6/2024.

Pada tahun 2023, Amkor Technology 0,225 USD telah dibayarkan sebagai dividen.

Dividen dari Amkor Technology dibayarkan dalam USD.