ChipMOS Technologies

ChipMOS Technologies News

News

0

Ticker

IMOS

ISIN

US16965P2020

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Actualités Eulerpool ChipMOS Technologies

Actualités de l'action ChipMOS Technologies

ChipMOS Technologies est suivi par de nombreux journalistes et investisseurs dans le monde. Nous rassemblons ici les dernières actualités concernant ChipMOS Technologies.

Communiqués de presse relatifs à l'action ChipMOS Technologies

ChipMOS Technologies publie régulièrement sur son site web des communiqués pertinents pour les investisseurs.

ChipMOS Technologies News 2026

Cette page contient toutes les actualités actuelles, analyses et communiqués de presse pour l'action ChipMOS Technologies (IMOS, ISIN : US16965P2020). Cela inclut les actualités Eulerpool, les analyses d'entreprise et les communiqués de presse officiels. Les données sont mises à jour régulièrement pour fournir aux investisseurs un aperçu complet des derniers développements chez ChipMOS Technologies.

ChipMOS Technologies Action

ChipMOS Technologies ChipMOS Technologies Inc, listed under the ticker IMOS with ISIN US16965P2020, is a company based in Hsinchu City, Taiwan, operating within the Information Technology sector. The company was founded through an IPO on June 19, 2001, and currently employs 651 people. ChipMOS Technologies engages in the research and development, manufacturing, and sale of integrated circuits, alongside providing related assembly and testing services. Its operations span across Taiwan, Japan, the People's Republic of China, and international markets. The company organizes its business into five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing, Bumping, and Others. It offers a range of leadframe-based packages, including small outline packages, thin small outline packages, and quad flat packages, as well as substrate-based packages such as FBGA, VFBGA, stacked chip-scale packages, TFBGA, LGA, COG, and COF. Additionally, ChipMOS provides testing solutions covering professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot arrangements, engineering support, device failure mode analysis, and automation systems for various IC types including simple digital logic, complex ASIC, high-speed digital, memory, and mixed signal devices. The company also delivers bumping services, intellectual property management, enabling technologies, and turnkey services encompassing wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment for display driver ICs, memory ICs, and logic mix applications. For more information, visit their website at https://www.chipmos.com.