Taiwan IC Packaging (3372.TWO) Action Cours

Taiwan IC Packaging Corp., listed under ticker 3372.TWO with ISIN TW0003372009, is a company based in Kaohsiung, Taiwan, operating within the Information Technology sector and the Semiconductors industry. The company has 475 employees and completed its initial public offering on August 3, 2004. Taiwan IC Packaging Corp. specializes in the manufacturing, packaging, and testing of integrated circuits. Its operations include the packaging of lead frame IC products such as thin small-outline packages (TSOPs), small-outline packages (SOPs), and quad flat packages (QFPs), as well as advanced IC packaging solutions like thin IC packages. The company's products are utilized in various applications including consumer electronics, computer peripherals, power management systems, drive components, mobile phones, wireless communication devices, IC tags, and memory cards for portable electronic devices. Taiwan IC Packaging Corp. distributes its products primarily within Taiwan, the United States, and Asia. The company's headquarters is located in Kaohsiung, and it maintains a website at http://www.ticp.com.tw for further information.