ChipMOS Technologies (8150.TW) Osake Kurssi

ChipMOS Technologies Inc is primarily active in the semiconductor industry.

The main competitors of ChipMOS Technologies Inc in the market are Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), and Amkor Technology.

ChipMOS Technologies Inc, founded in 1997, is a leading provider of semiconductor testing and assembly services. Headquartered in Taiwan, the company offers a wide range of services, including wafer probing, package assembly, and testing. With advanced manufacturing technologies and a strong focus on customer satisfaction, ChipMOS has established itself as a trusted partner in the global semiconductor industry. Over the years, the company has grown through strategic acquisitions and investments, expanding its capabilities and global presence. Today, ChipMOS Technologies Inc continues to innovate and deliver high-quality solutions that enable its customers to enhance their competitiveness in the ever-evolving semiconductor market.

ChipMOS Technologies Inc has achieved several significant milestones. The company has successfully established itself as a leading provider of semiconductor assembly and test services. ChipMOS has built a strong reputation for its expertise in advanced packaging and testing technologies, catering to the fast-growing demand for high-performance integrated circuits. Additionally, the company has expanded its global footprint through strategic partnerships and acquisitions, enabling it to serve a diverse customer base across various industries. ChipMOS Technologies Inc has consistently demonstrated its commitment to innovation, customer satisfaction, and sustainable growth, solidifying its position as a trusted name in the semiconductor industry.

ChipMOS Technologies Inc is primarily present in Taiwan, China, Japan, and the United States. With its headquarters located in Taiwan, ChipMOS Technologies Inc has established a strong presence in the Asia-Pacific region. It operates several manufacturing and testing facilities in Taiwan, China, and Japan, serving a wide range of customers in the semiconductor industry. In addition, the company has also expanded its business operations to include sales and technical support offices in the United States, enabling it to cater to the market demands and client needs in North America.

ChipMOS Technologies Inc. represents a strong commitment to quality, innovation, and customer satisfaction. With a focus on providing cutting-edge semiconductor assembly and test services, the company strives to deliver advanced solutions that meet the evolving needs of the technology industry. ChipMOS Technologies Inc. values efficient production processes and leverages its expertise to provide cost-effective solutions for clients. Guided by a results-oriented corporate philosophy, ChipMOS Technologies Inc. aims to drive growth, foster collaboration, and continuously enhance its capabilities to stay at the forefront of the semiconductor industry.

Analyytikot asettavat tällä hetkellä ChipMOS Technologies-osakkeelle keskimääräisen tavoitehinnan 40,65 TWD (mediaani: 40,65 TWD), mikä merkitsee −63,7 % viimeisimpään hintaan verrattuna. Konsensus perustuu 9 analyytikkoarvioon.

ChipMOS Technologies Analyytikkojen kursstavoitteet 2026

9 analyytikkoa arvioi tällä hetkellä ChipMOS Technologies-osaketta: 8 suosittaa ostoa, 1 pitoa ja 0 myyntiä. Vuodelle 2026 analyytikot odottavat ChipMOS Technologies-yhtiöltä 30,52 Mrd. TWD liikevaihtoa ja 4,82 TWD osakekohtaista tulosta.

ChipMOS Technologies Analyytikkojen kursstavoitteet 2026

Nykyisellä valuuttakurssilla ChipMOS Technologies-osake noteerataan hintaan 3,10 EUR (112,00 TWD).

ChipMOS Technologies-osake (8150.TW) on listattuna 1 pörssissä, muun muassa: TWSE (Taiwan) (8150.TW).

ChipMOS Technologies Inc. is a provider of comprehensive semiconductor and testing services. The company was founded in June 1997 and is headquartered in Taiwan. It operates production facilities in Taiwan and China, and its shares are traded on the Taiwan Stock Exchange (TWSE). The company specializes in three business areas: wafer-level packaging services, testing services, and assembly services. Each business area offers different products and services tailored to the needs of customers. In the wafer-level packaging services, ChipMOS offers versatile and customized packaging solutions. These include SiPs (System-in-Package), WLCSPs (Wafer-Level Chip-Scale Packages), COFs (Chip-on-Flex), and SoCs (System-on-Chip). The company can also provide various functions such as chip placement, bonding, and encapsulation on wafers. ChipMOS' testing business area offers testing services for various types of integrated circuits. These include analog and digital ICs, MEMS (Micro-Electromechanical Systems), and RF (Radio Frequency) ICs. The company also offers test platforms and equipment that can be used by semiconductor manufacturers. Finally, ChipMOS' assembly business area specializes in the production of wafer-level and package-level products. The company offers services ranging from silvering and gold-plating of bonding wires to assembly and linking services, as well as inspection and packaging of products. ChipMOS is committed to integrating the latest technologies and manufacturing processes into its services and products. This enables the company to offer cutting-edge technologies such as MEMS sensors and image sensors, which are in high demand in key technology market segments. ChipMOS' technological expertise also extends to CMOS image sensor production and 3D packaging technology. The company has achieved high customer satisfaction by offering high-quality products and services. It has built long-standing relationships with some of the largest and most renowned customers worldwide, including many in the automotive industry, medical field, consumer electronics, and others. In summary, ChipMOS Technologies Inc. is a leading provider of comprehensive semiconductor and testing services. The company offers a wide range of products and services tailored to the needs of customers. Although the company targets its activities towards various markets, it has particular expertise in the automotive and medical technology fields and offers specially tailored solutions in these areas. ChipMOS' technological competency is impressive and allows the company to capitalize on leading market trends.

odotettu liikevaihto ChipMOS Technologies on 30,52 Mrd. TWD. Tämä luku perustuu nykyisiin talousarvoihin ja heijastaa yhtiön liiketoimintasuoritusta.

odotettu voitto ChipMOS Technologies on 3,41 Mrd. TWD. Nettovoitto kuvastaa yhtiön kannattavuutta kaikkien kulujen vähentämisen jälkeen.

ChipMOS Technologies:n hinta-voitto-suhde (P/E) on tällä hetkellä 23,22. P/E-suhde vertaa nykyistä osakekurssia osakekohtaiseen tulokseen ja auttaa sijoittajia arvioimaan ChipMOS Technologies-osakkeen arvostusta.

ChipMOS Technologies:n hinta-myynti-suhde (P/S) on tällä hetkellä 2,60. P/S-suhde vertaa markkina-arvoa vuosittaisiin tuloihin ja toimii ChipMOS Technologies-osakkeen arvostuskennuslukuna.

ChipMOS Technologies:n Eulpool-laatuscore on 3/10.

ChipMOS Technologies:n ISIN on TW0008150004. ISIN (International Securities Identification Number) on maailmanlaajuisesti ainutlaatuinen arvopaperin tunnus.

ChipMOS Technologies:n ticker on 8150.TW. Tämä pörssinoteeraus käytetään ChipMOS Technologies-osakkeiden kauppaan pörssissä.

Viimeisten 12 kuukauden aikana ChipMOS Technologies maksoi osinkoa 1,23 TWD . Tämä vastaa osingontuottoa noin 1,10 %. Tulevien 12 kuukauden aikana ChipMOS Technologies odotetaan maksavan osinkoa 1,23 TWD.

ChipMOS Technologies:n nykyinen osinkotuotto on 1,10 %.

ChipMOS Technologies maksaa osinkoa, joka jaetaan kuukausina kesäkuu.

ChipMOS Technologies maksoi osinkoa joka vuosi viimeisten 13 vuoden aikana.

Tulevien 12 kuukauden aikana odotetaan osinkoja, joiden määrä on 1,23 TWD. Tämä vastaa osingontuottoa 1,10 %.

ChipMOS Technologies kuuluu sektoriin 'Informaatioteknologia'.

Vuonna 2025 ChipMOS Technologies jakoi 1,23 TWD osinkona.

ChipMOS Technologies:n osingot jaetaan valuutassa TWD.