ChipMOS Technologies (IMOS) Aktsia Kursus

ChipMOS Technologies Inc, listed under the ticker IMOS with ISIN US16965P2020, is a company based in Hsinchu City, Taiwan, operating within the Information Technology sector. The company was founded through an IPO on June 19, 2001, and currently employs 651 people. ChipMOS Technologies engages in the research and development, manufacturing, and sale of integrated circuits, alongside providing related assembly and testing services. Its operations span across Taiwan, Japan, the People's Republic of China, and international markets. The company organizes its business into five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing, Bumping, and Others. It offers a range of leadframe-based packages, including small outline packages, thin small outline packages, and quad flat packages, as well as substrate-based packages such as FBGA, VFBGA, stacked chip-scale packages, TFBGA, LGA, COG, and COF. Additionally, ChipMOS provides testing solutions covering professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot arrangements, engineering support, device failure mode analysis, and automation systems for various IC types including simple digital logic, complex ASIC, high-speed digital, memory, and mixed signal devices. The company also delivers bumping services, intellectual property management, enabling technologies, and turnkey services encompassing wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment for display driver ICs, memory ICs, and logic mix applications. For more information, visit their website at https://www.chipmos.com.