Eulerpool Data & Analytics 大连高新园区后英科技小额贷款有限公司 大连市, CN
Navn
大连高新园区后英科技小额贷款有限公司
Adresse / Hovedkontor
大连高新园区后英科技小额贷款有限公司
辽宁省大连市高新技术产业园区黄埔路541号19层1902-1室
116023 大连市
Legal Entity Identifier (LEI)
300300Z1742421000037
Legal Operating Unit (LOU)
655600IJ8LS3CCDA4421
Registrer
91210200098871719A
Virksomhedsform
ECAK
Virksomhedskategori
Generelt
Status
LAPSED
Valideringsstatus
Fuldt bekræftet
Senest opdateret
1.3.2022
Næste fornyelse
27.12.2021
Eulerpool API 大连高新园区后英科技小额贷款有限公司 Omsætning, overskud, balance, patenter, medarbejdere og mere 大连市, CN
{
"lei": "300300Z1742421000037",
"legal_jurisdiction": "CN",
"legal_name": "大连高新园区后英科技小额贷款有限公司",
"entity_category": "GENERAL",
"entity_legal_form_code": "ECAK",
"legal_first_address_line": "辽宁省大连市高新技术产业园区黄埔路541号19层1902-1室",
"legal_additional_address_line": "",
"legal_city": "大连市",
"legal_postal_code": "116023",
"headquarters_first_address_line": "辽宁省大连市高新技术产业园区黄埔路541号19层1902-1室",
"headquarters_additional_address_line": "",
"headquarters_city": "大连市",
"headquarters_postal_code": "116023",
"registration_authority_entity_id": "91210200098871719A",
"next_renewal_date": "2021-12-27T06:19:32.950Z",
"last_update_date": "2022-03-01T06:34:06.944Z",
"managing_lou": "655600IJ8LS3CCDA4421",
"registration_status": "LAPSED",
"validation_sources": "FULLY_CORROBORATED",
"reporting_exception": "",
"slug": "大连高新园区后英科技小额贷款有限公司,大连市,91210200098871719A"
}Andre virksomheder i samme jurisdiktion