HENGHUI Technology Corp

HENGHUI Technology Corp OCF/Debt

The Operating Cash Flow to Debt Ratio of HENGHUI Technology Corp (301678.SZ) as of Oct 28, 2026 is 9,123.61 %. In the previous year, Operating Cash Flow to Debt Ratio was 438.97 % — a change of 1,978.40% (higher).

OCF/Debt

9,123.61 %

YoY

1,978.40%

Last updated:

Operating Cash Flow to Debt Ratio of HENGHUI Technology Corp is 2024 9,123.61 % . Operating Cash Flow to Debt Ratio of HENGHUI Technology Corp was 2023 438.97 % . It decreases by 1,978.40% higher compared to the previous year.

The HENGHUI Technology Corp OCF/Debt history

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OCF/Debt
Date
OCF/Debt
Jan 1, 2022
167.45 CNY
Jan 1, 2023
438.97 CNY
Jan 1, 2024
9,123.61 CNY
The HENGHUI Technology Corp OCF/Debt history
YEAROCF/DebtYoY
9,123.61 %+1,978.40%
438.97 %+162.16%
167.45 %—

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HENGHUI Technology Corp Stock analysis

What does HENGHUI Technology Corp do? HENGHUI Technology Corp. Ltd. generates revenue through the research, development, production, and sale of chip packaging materials, primarily focusing on flexible lead frame products for smart card chips and IoT eSIM chip packaging and testing. The company's smart card business offers customers module products or packaging services using self-produced flexible lead frames, while its etching lead frame business and IoT eSIM chip packaging and testing business serve domestic and overseas markets. Key products include flexible lead frame products, smart card modules, and IoT eSIM chip packaging services, targeting customers in the smart card and IoT industries. The firm's main revenue streams come from the smart card business, which includes the production and sales of flexible lead frame products and associated module services, as well as the IoT eSIM chip packaging and testing business. These services are provided to customers in both domestic and international markets, with the company operating across the smart card and IoT sectors. The etching lead frame business complements these offerings by supplying specialized materials for chip packaging. HENGHUI Technology Corp. Ltd. serves customers in the smart card and IoT industries, delivering packaging solutions for chip manufacturing. Its products, such as flexible lead frames and IoT eSIM chip packaging, are sold to clients requiring advanced packaging for smart card chips and IoT devices. The company's domestic and overseas market presence ensures a broad customer base across different regions. HENGHUI Technology Corp is one of the most popular companies on Eulerpool.

Frequently Asked Questions about HENGHUI Technology Corp stock

Operating Cash Flow to Debt Ratio of HENGHUI Technology Corp is 9,123.61 % in 2024.

Operating Cash Flow to Debt Ratio of HENGHUI Technology Corp changed from 438.97 % to 9,123.61 %, representing a 1,978.40% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Operating Cash Flow to Debt Ratio HENGHUI Technology Corp since 2006 – with annual values, charts, and detailed analysis.

OCF/Debt measures what percentage of total debt can be covered by annual operating cash flow. Higher ratios indicate stronger debt repayment capacity.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Operating Cash Flow to Debt Ratio's HENGHUI Technology Corp with sector peers and the industry average to assess whether it is attractive.

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Leverage — HENGHUI Technology Corp

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