HENGHUI Technology Corp

HENGHUI Technology Corp Liabilities

The The Liabilities of HENGHUI Technology Corp (301678.SZ) as of Oct 16, 2026 is 140.18 M CNY. In the previous year, The Liabilities was 139.40 M CNY — a change of 0.56% (higher).

Liabilities

140.18 MCNY

YoY

0.56%

Last updated:

In 2024, HENGHUI Technology Corp's total liabilities amounted to 140.18 M CNY, a 0.56% difference from the 139.40 M CNY total liabilities in the previous year.

The HENGHUI Technology Corp Liabilities history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Liabilities
Date
Liabilities
Jan 1, 2022
200.64 M CNY
Jan 1, 2023
139.40 M CNY
Jan 1, 2024
140.18 M CNY
The HENGHUI Technology Corp Liabilities history
YEARLiabilitiesYoY
140.18 MCNY+0.56%
139.40 MCNY-30.52%
200.64 MCNY—

Access this data via the Eulerpool API

100,000 free requests/mo · no credit card

Get Free API Key

HENGHUI Technology Corp Stock analysis

What does HENGHUI Technology Corp do? HENGHUI Technology Corp Ltd is a company based in Zibo, China, operating within the Information Technology sector, specifically in the Semiconductors industry. The company focuses on the research, development, production, and sale of chip packaging materials. With a workforce of 800 employees, it serves both domestic and international markets. HENGHUI Technology Corp Ltd completed its IPO on June 20, 2025, with the ticker 301678.SZ and ISIN CNE1000071H6. The company's primary business areas include smart card-related activities, etching lead frame production, and IoT eSIM chip packaging and testing. Its smart card business involves the development, manufacturing, and distribution of flexible lead frame products, which are essential components for smart card chips. Additionally, the company provides smart card module products and module packaging services using internally produced flexible lead frames. The firm's website is http://www.henghuiic.com/. HENGHUI Technology Corp Ltd is engaged in the production of key materials for semiconductor packaging, contributing to the broader semiconductor supply chain. The company's operations are centered around the development and commercialization of specialized packaging solutions for electronic components, particularly within the smart card and IoT sectors. It maintains a presence in both Chinese and global markets, leveraging its technical expertise in semiconductor packaging materials. HENGHUI Technology Corp is one of the most popular companies on Eulerpool.

Liabilities Details

Assessing HENGHUI Technology Corp's Liabilities

HENGHUI Technology Corp's liabilities constitute the company's financial obligations and debts owed to external parties and stakeholders. They are categorized into current liabilities, due within a year, and long-term liabilities, which are due over a longer period. A detailed assessment of these liabilities is crucial for evaluating HENGHUI Technology Corp's financial stability, operational efficiency, and long-term viability.

Year-to-Year Comparison

By comparing HENGHUI Technology Corp's liabilities year-over-year, investors can identify trends, shifts, and anomalies in the company’s financial positioning. A decrease in total liabilities often signals financial strengthening, while an increase might indicate enhanced investments, acquisitions, or potential financial strain.

Impact on Investments

HENGHUI Technology Corp's total liabilities play a significant role in determining the company's leverage and risk profile. Investors and analysts examine this aspect meticulously to ascertain the firm’s ability to meet its financial obligations, which influences investment attractiveness and credit ratings.

Interpreting Liability Fluctuations

Shifts in HENGHUI Technology Corp’s liability structure indicate changes in its financial management and strategy. A reduction in liabilities reflects efficient financial management or debt payoffs, while an increase may suggest expansion, acquisition activities, or accruing operational expenses, each carrying distinct implications for investors.

Frequently Asked Questions about HENGHUI Technology Corp stock

The Liabilities of HENGHUI Technology Corp is 140.18 M CNY in 2024.

The Liabilities of HENGHUI Technology Corp changed from 139.40 M CNY to 140.18 M CNY, representing a 0.56% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of The Liabilities HENGHUI Technology Corp since 2006 – with annual values, charts, and detailed analysis.

The Liabilities's CNY is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track The Liabilities's HENGHUI Technology Corp historically and in real time.

Access this data via the Eulerpool API

100,000 free requests/mo · no credit card

Get Free API Key

Balance Sheet — HENGHUI Technology Corp

Total AssetsCurrent AssetsCash & EquivalentsReceivablesInventoryProperty, Plant & EquipmentGoodwillIntangible AssetsEquityLiabilitiesDebtCurrent LiabilitiesLong-term DebtShort-term DebtRetained EarningsBook Value per ShareTangible Book Value per ShareWorking CapitalInvestmentsAccounts PayableNon-Current AssetsShort-Term InvestmentsLong-Term InvestmentsNet DebtTreasury StockMinority InterestDeferred Tax LiabilitiesNet Tangible AssetsGoodwill/AssetsIntangibles/Assets

All Key Metrics — HENGHUI Technology Corp