HENGHUI Technology Corp

HENGHUI Technology Corp Net Debt / EBITDA

The Net Debt to EBITDA of HENGHUI Technology Corp (301678.SZ) as of Oct 27, 2026 is -1.96. In the previous year, Net Debt to EBITDA was -1.04 — a change of 87.87% (lower).

Net Debt / EBITDA

-1.96

YoY

87.87%

Last updated:

Net Debt to EBITDA of HENGHUI Technology Corp is 2024 -1.96 . Net Debt to EBITDA of HENGHUI Technology Corp was 2023 -1.04 . It decreases by 87.87% lower compared to the previous year.

The HENGHUI Technology Corp Net Debt / EBITDA history

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Net Debt / EBITDA
Date
Net Debt / EBITDA
Jan 1, 2022
-0.88 CNY
Jan 1, 2023
-1.04 CNY
Jan 1, 2024
-1.96 CNY
The HENGHUI Technology Corp Net Debt / EBITDA history
YEARNet Debt / EBITDAYoY
-1.96+87.87%
-1.04+18.02%
-0.88—

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HENGHUI Technology Corp Stock analysis

What does HENGHUI Technology Corp do? HENGHUI Technology Corp. Ltd. generates revenue through the research, development, production, and sale of chip packaging materials, primarily focusing on flexible lead frame products for smart card chips and IoT eSIM chip packaging and testing. The company's smart card business offers customers module products or packaging services using self-produced flexible lead frames, while its etching lead frame business and IoT eSIM chip packaging and testing business serve domestic and overseas markets. Key products include flexible lead frame products, smart card modules, and IoT eSIM chip packaging services, targeting customers in the smart card and IoT industries. The firm's main revenue streams come from the smart card business, which includes the production and sales of flexible lead frame products and associated module services, as well as the IoT eSIM chip packaging and testing business. These services are provided to customers in both domestic and international markets, with the company operating across the smart card and IoT sectors. The etching lead frame business complements these offerings by supplying specialized materials for chip packaging. HENGHUI Technology Corp. Ltd. serves customers in the smart card and IoT industries, delivering packaging solutions for chip manufacturing. Its products, such as flexible lead frames and IoT eSIM chip packaging, are sold to clients requiring advanced packaging for smart card chips and IoT devices. The company's domestic and overseas market presence ensures a broad customer base across different regions. HENGHUI Technology Corp is one of the most popular companies on Eulerpool.

Frequently Asked Questions about HENGHUI Technology Corp stock

Net Debt to EBITDA of HENGHUI Technology Corp is -1.96 in 2024.

Net Debt to EBITDA of HENGHUI Technology Corp changed from -1.04 to -1.96, representing a 87.87% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of Net Debt to EBITDA HENGHUI Technology Corp since 2006 – with annual values, charts, and detailed analysis.

Net Debt/EBITDA measures how many years it would take to repay all debt using EBITDA. Lower ratios indicate stronger debt repayment capacity.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Net Debt to EBITDA's HENGHUI Technology Corp with sector peers and the industry average to assess whether it is attractive.

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Leverage — HENGHUI Technology Corp

All Key Metrics — HENGHUI Technology Corp