HENGHUI Technology Corp

HENGHUI Technology Corp Net Debt

The Net Debt of HENGHUI Technology Corp (301678.SZ) as of Oct 28, 2026 is -396.75 M CNY. In the previous year, Net Debt was -185.26 M CNY — a change of 114.16% (lower).

Net Debt

-396.75 MCNY

YoY

114.16%

Last updated:

Net Debt of HENGHUI Technology Corp is 2024 -396.75 M CNY. Net Debt of HENGHUI Technology Corp was 2023 -185.26 M CNY. It decreases by 114.16% lower compared to the previous year.

The HENGHUI Technology Corp Net Debt history

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Net Debt
Date
Net Debt
Jan 1, 2022
-110.20 M CNY
Jan 1, 2023
-185.26 M CNY
Jan 1, 2024
-396.75 M CNY
The HENGHUI Technology Corp Net Debt history
YEARNet DebtYoY
-396.75 MCNY+114.16%
-185.26 MCNY+68.11%
-110.20 MCNY—

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HENGHUI Technology Corp Stock analysis

What does HENGHUI Technology Corp do? HENGHUI Technology Corp. Ltd. generates revenue through the research, development, production, and sale of chip packaging materials, primarily focusing on flexible lead frame products for smart card chips and IoT eSIM chip packaging and testing. The company's smart card business offers customers module products or packaging services using self-produced flexible lead frames, while its etching lead frame business and IoT eSIM chip packaging and testing business serve domestic and overseas markets. Key products include flexible lead frame products, smart card modules, and IoT eSIM chip packaging services, targeting customers in the smart card and IoT industries. The firm's main revenue streams come from the smart card business, which includes the production and sales of flexible lead frame products and associated module services, as well as the IoT eSIM chip packaging and testing business. These services are provided to customers in both domestic and international markets, with the company operating across the smart card and IoT sectors. The etching lead frame business complements these offerings by supplying specialized materials for chip packaging. HENGHUI Technology Corp. Ltd. serves customers in the smart card and IoT industries, delivering packaging solutions for chip manufacturing. Its products, such as flexible lead frames and IoT eSIM chip packaging, are sold to clients requiring advanced packaging for smart card chips and IoT devices. The company's domestic and overseas market presence ensures a broad customer base across different regions. HENGHUI Technology Corp is one of the most popular companies on Eulerpool.

Frequently Asked Questions about HENGHUI Technology Corp stock

Net Debt of HENGHUI Technology Corp is -396.75 M CNY in 2024.

Net Debt of HENGHUI Technology Corp changed from -185.26 M CNY to -396.75 M CNY, representing a 114.16% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of Net Debt HENGHUI Technology Corp since 2006 – with annual values, charts, and detailed analysis.

Net debt is total debt minus cash and cash equivalents. It shows the actual debt burden after accounting for available liquid resources.

Net Debt's CNY is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track Net Debt's HENGHUI Technology Corp historically and in real time.

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Balance Sheet — HENGHUI Technology Corp

All Key Metrics — HENGHUI Technology Corp