HENGHUI Technology Corp

HENGHUI Technology Corp FCF/Debt

The Free Cash Flow to Debt Ratio of HENGHUI Technology Corp (301678.SZ) as of Oct 16, 2026 is 8,543.23 %. In the previous year, Free Cash Flow to Debt Ratio was 345.85 % — a change of 2,370.21% (higher).

FCF/Debt

8,543.23 %

YoY

2,370.21%

Last updated:

Free Cash Flow to Debt Ratio of HENGHUI Technology Corp is 2024 8,543.23 % . Free Cash Flow to Debt Ratio of HENGHUI Technology Corp was 2023 345.85 % . It decreases by 2,370.21% higher compared to the previous year.

The HENGHUI Technology Corp FCF/Debt history

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FCF/Debt
Date
FCF/Debt
Jan 1, 2022
52.57 CNY
Jan 1, 2023
345.85 CNY
Jan 1, 2024
8,543.23 CNY
The HENGHUI Technology Corp FCF/Debt history
YEARFCF/DebtYoY
8,543.23 %+2,370.21%
345.85 %+557.87%
52.57 %—

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HENGHUI Technology Corp Stock analysis

What does HENGHUI Technology Corp do? HENGHUI Technology Corp Ltd is a company based in Zibo, China, operating within the Information Technology sector, specifically in the Semiconductors industry. The company focuses on the research, development, production, and sale of chip packaging materials. With a workforce of 800 employees, it serves both domestic and international markets. HENGHUI Technology Corp Ltd completed its IPO on June 20, 2025, with the ticker 301678.SZ and ISIN CNE1000071H6. The company's primary business areas include smart card-related activities, etching lead frame production, and IoT eSIM chip packaging and testing. Its smart card business involves the development, manufacturing, and distribution of flexible lead frame products, which are essential components for smart card chips. Additionally, the company provides smart card module products and module packaging services using internally produced flexible lead frames. The firm's website is http://www.henghuiic.com/. HENGHUI Technology Corp Ltd is engaged in the production of key materials for semiconductor packaging, contributing to the broader semiconductor supply chain. The company's operations are centered around the development and commercialization of specialized packaging solutions for electronic components, particularly within the smart card and IoT sectors. It maintains a presence in both Chinese and global markets, leveraging its technical expertise in semiconductor packaging materials. HENGHUI Technology Corp is one of the most popular companies on Eulerpool.

Frequently Asked Questions about HENGHUI Technology Corp stock

Free Cash Flow to Debt Ratio of HENGHUI Technology Corp is 8,543.23 % in 2024.

Free Cash Flow to Debt Ratio of HENGHUI Technology Corp changed from 345.85 % to 8,543.23 %, representing a 2,370.21% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Free Cash Flow to Debt Ratio HENGHUI Technology Corp since 2006 – with annual values, charts, and detailed analysis.

FCF/Debt measures the percentage of total debt that could be repaid from free cash flow. It is a stricter measure than OCF/Debt as it accounts for capital expenditures.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Free Cash Flow to Debt Ratio's HENGHUI Technology Corp with sector peers and the industry average to assess whether it is attractive.

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Leverage — HENGHUI Technology Corp

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