Eulerpool Data & Analytics 厦门润量半导体材料科技有限公司
厦门市, CN

Nimi

厦门润量半导体材料科技有限公司

Osoite / Pääkonttori

厦门润量半导体材料科技有限公司

厦门市集美区集美大道1302号创业大厦第六层613单元之四

361000 厦门市

Legal Entity Identifier (LEI)

83680050N972H42T3D35

Legal Operating Unit (LOU)

655600IJ8LS3CCDA4421

Rekisteröidy

91350211MA33FLDY5Y

Yhtiömuoto

ECAK

Yritysluokka

Yleinen

Tila

LAPSED

Validoinnin tila

Täysin vahvistettu

Viimeksi päivitetty

1.3.2022

Seuraava uudistuminen

17.12.2022

Eulerpool API
厦门润量半导体材料科技有限公司 Liikevaihto, voitto, tase, patentit, työntekijät ja enemmän
厦门市, CN

{
    "lei": "83680050N972H42T3D35",
    "legal_jurisdiction": "CN",
    "legal_name": "厦门润量半导体材料科技有限公司",
    "entity_category": "GENERAL",
    "entity_legal_form_code": "ECAK",
    "legal_first_address_line": "厦门市集美区集美大道1302号创业大厦第六层613单元之四",
    "legal_additional_address_line": "",
    "legal_city": "厦门市",
    "legal_postal_code": "361000",
    "headquarters_first_address_line": "厦门市集美区集美大道1302号创业大厦第六层613单元之四",
    "headquarters_additional_address_line": "",
    "headquarters_city": "厦门市",
    "headquarters_postal_code": "361000",
    "registration_authority_entity_id": "91350211MA33FLDY5Y",
    "next_renewal_date": "2022-12-17T03:39:22.108Z",
    "last_update_date": "2022-03-01T06:34:06.944Z",
    "managing_lou": "655600IJ8LS3CCDA4421",
    "registration_status": "LAPSED",
    "validation_sources": "FULLY_CORROBORATED",
    "reporting_exception": "",
    "slug": "厦门润量半导体材料科技有限公司,厦门市,91350211MA33FLDY5Y"
}