BE Semiconductor Industries ROCE 2024

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BE Semiconductor Industries NV, also known as "Besi", is a Dutch company specializing in the development and production of semiconductor bonding technologies for the semiconductor industry. Founded in 1995, the company has experienced impressive growth and has become a leading provider of bonding technologies for the semiconductor industry. Besi is headquartered in Duiven, Netherlands, and operates offices and production facilities worldwide. The company employs over 1,700 employees and is listed on the Euronext Stock Exchange in Amsterdam. The business model of BE Semiconductor Industries focuses on improving the production of semiconductor applications such as smart cards, RFID chips, smartphones, tablet PCs, wearables, and other electronic devices. The company manufactures its bonding technologies and semiconductor modules to achieve significant improvements in process flows in the semiconductor industry. Besi relies on high automation to ensure fast production cycles and minimize logistical efforts. Besi's business is divided into three segments: Advanced Packaging, Die Attach, and Surface Mount Technology. Advanced Packaging includes all bonding technologies for chip embedding, including 2.5D and 3D packaging technology, flip-chip technology, and embedded die packaging technology. Die Attach refers to the processes of mounting semiconductor chips onto substrates. Surface Mount Technology reflects the assembly technology for mounting small components on a PCB or other electronic substrate and is considered a key technology for board connection. Besi offers a wide range of products that focus on the entire spectrum of bonding technologies. The company is a leading provider of bonding technology solutions for semiconductor products. It provides its customers with a wide selection of semiconductor modules, adhesives, and testing tools to improve the quality of semiconductor products. Besi works closely with its customers to develop customized solutions for their specific requirements. The company specializes in integrated interconnects to simplify the manufacturing of semiconductor chips and enable individual customization. Wire bonding technology, C4NP bonding technology, flip-chip technology, and embedded die technology are just a few examples of the customized solutions Besi offers to its customers. As part of its expansion and transition to automated production processes, Besi has also invested in machinery and equipment to increase its production capacity. This includes high-performance machines specifically designed for the production of semiconductors and bonding technologies. Besi has also invested in research and development to develop innovative technology solutions that meet the needs of its customers while ensuring cost-effective and fast production processes. In summary, BE Semiconductor Industries NV is a leading provider of bonding technologies for the semiconductor industry. The company offers its customers a wide range of customized solutions focusing on the entire spectrum of bonding technologies. Besi is an example of how a company can develop innovative, customer-specific semiconductor bonding technologies through focus, research, and commitment. BE Semiconductor Industries ist eines der beliebtesten Unternehmen auf Eulerpool.com.