Tianshui Huatian Technology Co

Tianshui Huatian Technology Co FCF/Debt

The Free Cash Flow to Debt Ratio of Tianshui Huatian Technology Co (002185.SZ) as of Oct 25, 2026 is -15.58 %. In the previous year, Free Cash Flow to Debt Ratio was -13.27 % — a change of 17.47% (lower).

FCF/Debt

-15.58 %

YoY

17.47%

Last updated:

Free Cash Flow to Debt Ratio of Tianshui Huatian Technology Co is 2024 -15.58 % . Free Cash Flow to Debt Ratio of Tianshui Huatian Technology Co was 2023 -13.27 % . It decreases by 17.47% lower compared to the previous year.

The Tianshui Huatian Technology Co FCF/Debt history

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FCF/Debt
Date
FCF/Debt
Jan 1, 2017
-81.21 CNY
Jan 1, 2018
-12.24 CNY
Jan 1, 2019
-5.48 CNY
Jan 1, 2020
-22.57 CNY
Jan 1, 2021
-31.71 CNY
Jan 1, 2022
-34.97 CNY
Jan 1, 2023
-13.27 CNY
Jan 1, 2024
-15.58 CNY
The Tianshui Huatian Technology Co FCF/Debt history
YEARFCF/DebtYoY
-15.58 %+17.47%
-13.27 %-62.06%
-34.97 %+10.27%
-31.71 %+40.53%
-22.57 %+311.82%
-5.48 %-55.22%
-12.24 %-84.93%
-81.21 %-38.25%
-131.52 %+341.01%
-29.82 %+339.30%
-6.79 %—

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Tianshui Huatian Technology Co Stock analysis

What does Tianshui Huatian Technology Co do? Tianshui Huatian Technology Co., Ltd. generates revenue through semiconductor integrated circuits testing and packaging services. The company offers IC packaging and testing products including DIP series, SOP series, SSOP series, QFP series, and SOT series. It also provides LED products for domestic and overseas markets. The firm serves customers requiring semiconductor manufacturing services, with its products distributed across both domestic and international segments. The company's product portfolio includes dual in-line package (DIP), small out-line package (SOP), shrink small out-line package (SSOP), quad flat package (QFP), and small out-line transistor (SOT) series. These are used by manufacturers needing semiconductor assembly and testing solutions. LED products complement the semiconductor services, targeting both local and global clients. The firm's domestic market focus aligns with its headquarters in Tianshui, Gansu, while overseas distribution supports international demand. Revenue streams come from the sale of IC packaging and testing services alongside LED products. The domestic market segment includes Chinese manufacturers, while overseas markets serve global clients seeking semiconductor solutions. The company's product lines are tailored to meet industry standards for semiconductor packaging, with no additional services or products mentioned beyond those specified. Tianshui Huatian Technology Co is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Tianshui Huatian Technology Co stock

Free Cash Flow to Debt Ratio of Tianshui Huatian Technology Co is -15.58 % in 2024.

Free Cash Flow to Debt Ratio of Tianshui Huatian Technology Co changed from -13.27 % to -15.58 %, representing a 17.47% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of Free Cash Flow to Debt Ratio Tianshui Huatian Technology Co since 2006 – with annual values, charts, and detailed analysis.

FCF/Debt measures the percentage of total debt that could be repaid from free cash flow. It is a stricter measure than OCF/Debt as it accounts for capital expenditures.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Free Cash Flow to Debt Ratio's Tianshui Huatian Technology Co with sector peers and the industry average to assess whether it is attractive.

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