Tianshui Huatian Technology Co

Tianshui Huatian Technology Co Debt/EBITDA

The Total Debt to EBITDA Ratio of Tianshui Huatian Technology Co (002185.SZ) as of Nov 1, 2026 is 10.16. In the previous year, Total Debt to EBITDA Ratio was 23.61 — a change of -56.95% (lower).

Debt/EBITDA

10.16

YoY

-56.95%

Last updated:

Total Debt to EBITDA Ratio of Tianshui Huatian Technology Co is 2024 10.16 . Total Debt to EBITDA Ratio of Tianshui Huatian Technology Co was 2023 23.61 . It decreases by -56.95% lower compared to the previous year.

The Tianshui Huatian Technology Co Debt/EBITDA history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Debt/EBITDA
Date
Debt/EBITDA
Jan 1, 2017
1.59 CNY
Jan 1, 2018
7.31 CNY
Jan 1, 2019
5.64 CNY
Jan 1, 2020
4.26 CNY
Jan 1, 2021
3.22 CNY
Jan 1, 2022
5.84 CNY
Jan 1, 2023
23.61 CNY
Jan 1, 2024
10.16 CNY
The Tianshui Huatian Technology Co Debt/EBITDA history
YEARDebt/EBITDAYoY
10.16-56.95%
23.61+304.54%
5.84+81.14%
3.22-24.30%
4.26-24.52%
5.64-22.82%
7.31+360.33%
1.59+45.10%
1.09-60.12%
2.74+16.89%
2.35—

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Tianshui Huatian Technology Co Stock analysis

What does Tianshui Huatian Technology Co do? Tianshui Huatian Technology Co., Ltd. generates revenue through semiconductor integrated circuits testing and packaging services. The company offers IC packaging and testing products including DIP series, SOP series, SSOP series, QFP series, and SOT series. It also provides LED products for domestic and overseas markets. The firm serves customers requiring semiconductor manufacturing services, with its products distributed across both domestic and international segments. The company's product portfolio includes dual in-line package (DIP), small out-line package (SOP), shrink small out-line package (SSOP), quad flat package (QFP), and small out-line transistor (SOT) series. These are used by manufacturers needing semiconductor assembly and testing solutions. LED products complement the semiconductor services, targeting both local and global clients. The firm's domestic market focus aligns with its headquarters in Tianshui, Gansu, while overseas distribution supports international demand. Revenue streams come from the sale of IC packaging and testing services alongside LED products. The domestic market segment includes Chinese manufacturers, while overseas markets serve global clients seeking semiconductor solutions. The company's product lines are tailored to meet industry standards for semiconductor packaging, with no additional services or products mentioned beyond those specified. Tianshui Huatian Technology Co is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Tianshui Huatian Technology Co stock

Total Debt to EBITDA Ratio of Tianshui Huatian Technology Co is 10.16 in 2024.

Total Debt to EBITDA Ratio of Tianshui Huatian Technology Co changed from 23.61 to 10.16, representing a -56.95% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of Total Debt to EBITDA Ratio Tianshui Huatian Technology Co since 2006 – with annual values, charts, and detailed analysis.

Debt/EBITDA measures total debt relative to earnings before interest, taxes, depreciation, and amortization. It indicates the years needed to repay all debt from EBITDA.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Total Debt to EBITDA Ratio's Tianshui Huatian Technology Co with sector peers and the industry average to assess whether it is attractive.

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