Epoxy Base Electronic Material Corp Stock

Epoxy Base Electronic Material Corp FCF/Debt

The Free Cash Flow to Debt Ratio of Epoxy Base Electronic Material Corp (603002.SS) as of Aug 14, 2026 is -191.49 %. In the previous year, Free Cash Flow to Debt Ratio was 7.35 % — a change of -2,704.01% (lower).

FCF/Debt

-191.49 %

YoY

-2,704.01%

Last updated:

Free Cash Flow to Debt Ratio of Epoxy Base Electronic Material Corp is 2026 -191.49 % . Free Cash Flow to Debt Ratio of Epoxy Base Electronic Material Corp was 2025 7.35 % . It decreases by -2,704.01% lower compared to the previous year.
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Epoxy Base Electronic Material Corp Stock analysis

What does Epoxy Base Electronic Material Corp do? Epoxy Base Electronic Material Corp is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Epoxy Base Electronic Material Corp stock

Free Cash Flow to Debt Ratio of Epoxy Base Electronic Material Corp is -191.49 % in 2026.

Free Cash Flow to Debt Ratio of Epoxy Base Electronic Material Corp changed from 7.35 % to -191.49 %, representing a -2,704.01% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of Free Cash Flow to Debt Ratio Epoxy Base Electronic Material Corp since 2006 – with annual values, charts, and detailed analysis.

FCF/Debt measures the percentage of total debt that could be repaid from free cash flow. It is a stricter measure than OCF/Debt as it accounts for capital expenditures.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Free Cash Flow to Debt Ratio's Epoxy Base Electronic Material Corp with sector peers and the industry average to assess whether it is attractive.

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Leverage — Epoxy Base Electronic Material Corp

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