Epoxy Base Electronic Material Corp

Epoxy Base Electronic Material Corp Debt/EBITDA

The Total Debt to EBITDA Ratio of Epoxy Base Electronic Material Corp (603002.SS) as of Oct 26, 2026 is 11.86. In the previous year, Total Debt to EBITDA Ratio was 3.50 — a change of 238.75% (higher).

Debt/EBITDA

11.86

YoY

238.75%

Last updated:

Total Debt to EBITDA Ratio of Epoxy Base Electronic Material Corp is 2025 11.86 . Total Debt to EBITDA Ratio of Epoxy Base Electronic Material Corp was 2024 3.50 . It decreases by 238.75% higher compared to the previous year.

The Epoxy Base Electronic Material Corp Debt/EBITDA history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Debt/EBITDA
Date
Debt/EBITDA
Jan 1, 2018
1.57 CNY
Jan 1, 2019
0.64 CNY
Jan 1, 2020
0.39 CNY
Jan 1, 2021
0.25 CNY
Jan 1, 2022
0.18 CNY
Jan 1, 2023
3.48 CNY
Jan 1, 2024
3.50 CNY
Jan 1, 2025
11.86 CNY
The Epoxy Base Electronic Material Corp Debt/EBITDA history
YEARDebt/EBITDAYoY
11.86+238.75%
3.50+0.51%
3.48+1,783.20%
0.18-24.90%
0.25-36.19%
0.39-39.70%
0.64-59.17%
1.57-38.52%
2.55-41.73%
4.38+2.00 M%
0.00-99.99%
1.62—

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Epoxy Base Electronic Material Corp Stock analysis

What does Epoxy Base Electronic Material Corp do? Epoxy Base Electronic Material Corp. Ltd. generates revenue through the production and sale of electronic grade epoxy resins. The company offers liquid epoxy resins, flame retardant epoxy resins, solid epoxy resins, solvent epoxy resins, high-frequency and high-speed copper-clad laminates, and substrates for high-density interconnection. Its products are primarily sold to industries such as electrical and electronic manufacturing, coatings, composite materials, consumer electronics, network communication equipment, and smart home electronic equipment. The firm distributes its products domestically and internationally, serving both Chinese and overseas markets. The company's main product segments include liquid, flame retardant, solid, and solvent epoxy resins, alongside high-frequency and high-speed copper-clad laminates and high-density interconnection substrates. These products target sectors requiring advanced materials for electronic applications, including consumer electronics and network communication equipment manufacturers. The firm's distribution channels cover domestic sales within Guangdong and international markets, ensuring broad market reach. Epoxy Base Electronic Material Corp. Ltd. serves the electrical and electronic industry with specialized epoxy resins tailored for high-performance applications. Its product portfolio supports manufacturing processes in coatings, composite materials, and smart home electronics. The company's domestic and overseas market presence allows it to cater to both local and global demand for electronic materials used in advanced electronic devices. Epoxy Base Electronic Material Corp is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Epoxy Base Electronic Material Corp stock

Total Debt to EBITDA Ratio of Epoxy Base Electronic Material Corp is 11.86 in 2025.

Total Debt to EBITDA Ratio of Epoxy Base Electronic Material Corp changed from 3.50 to 11.86, representing a 238.75% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Total Debt to EBITDA Ratio Epoxy Base Electronic Material Corp since 2006 – with annual values, charts, and detailed analysis.

Debt/EBITDA measures total debt relative to earnings before interest, taxes, depreciation, and amortization. It indicates the years needed to repay all debt from EBITDA.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Total Debt to EBITDA Ratio's Epoxy Base Electronic Material Corp with sector peers and the industry average to assess whether it is attractive.

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Leverage — Epoxy Base Electronic Material Corp

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