Winbond Electronics

Winbond Electronics Liabilities

The The Liabilities of Winbond Electronics (2344.TW) as of Nov 11, 2026 is 78.06 B TWD. In the previous year, The Liabilities was 78.62 B TWD — a change of -0.72% (lower).

Liabilities

78.06 BTWD

YoY

-0.72%

Last updated:

In 2025, Winbond Electronics's total liabilities amounted to 78.06 B TWD, a -0.72% difference from the 78.62 B TWD total liabilities in the previous year.

The Winbond Electronics Liabilities history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Liabilities
Date
Liabilities
Jan 1, 2018
32.15 B TWD
Jan 1, 2019
40.95 B TWD
Jan 1, 2020
55.45 B TWD
Jan 1, 2021
62.71 B TWD
Jan 1, 2022
81.43 B TWD
Jan 1, 2023
90.33 B TWD
Jan 1, 2024
78.62 B TWD
Jan 1, 2025
78.06 B TWD
The Winbond Electronics Liabilities history
YEARLiabilitiesYoY
78.06 BTWD-0.72%
78.62 BTWD-12.96%
90.33 BTWD+10.93%
81.43 BTWD+29.86%
62.71 BTWD+13.09%
55.45 BTWD+35.42%
40.95 BTWD+27.36%
32.15 BTWD+21.38%
26.49 BTWD+16.34%
22.77 BTWD+1.20%
22.50 BTWD-12.08%
25.59 BTWD—

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Winbond Electronics Stock analysis

What does Winbond Electronics do? Winbond Electronics Corp is a semiconductor company based in Taiwan. Founded in 1987 as a joint venture between global electronics manufacturers National Semiconductor and United Microelectronics Corporation, Winbond has specialized in the development and manufacturing of integrated circuits (ICs) and quickly became a leading provider in this field. Winbond's business model is based on the production of memory ICs and logic ICs for a variety of applications, including consumer electronics, computer peripherals, automotive electronics, telecommunications, and industrial automation. The company offers a wide range of products, ranging from simple memory chips to complex system-on-chip solutions. Winbond's product divisions include DRAM and NAND flash memory, as well as specialized IoT solutions. Some of the company's most well-known products include the W25Q128FV flash memory, used in many consumer electronic devices such as smart TVs and tablets, and the W25M02GV SPI flash, widely used in IoT applications due to its small footprint and low power consumption. In recent years, Winbond Electronics Corp has also invested heavily in the development of 3D NAND flash memory to solidify its position in the market and attract new customers. These memory solutions offer higher capacity and lower costs per bit compared to conventional NAND flash memory. The company has also announced a focus on semiconductor solutions for 5G network technologies to grow in the emerging market of mobile data communication. Winbond Electronics Corp's history is characterized by numerous technological breakthroughs and significant changes in the semiconductor industry. In the early 1990s, the company was one of the pioneers in the introduction of flash memory for use in mobile phones. In the 2000s, the company expanded its business scope through the development of system-on-chip solutions and increased its focus on the export market. Since then, Winbond Electronics Corp has expanded its presence in other countries and regions through strategic partnerships and acquisitions, including Europe, North America, Asia, and Australia. The company currently operates production facilities in Taiwan, China, and the USA, employing approximately 4,000 people worldwide. Overall, Winbond Electronics Corp is a highly respected company in the semiconductor industry, known for its world-class products, innovation, and quality. With its years of experience, technological breakthroughs, and constant investments in research and development, Winbond will continue to play an important role in the global semiconductor industry. Winbond Electronics is one of the most popular companies on Eulerpool.

Liabilities Details

Assessing Winbond Electronics's Liabilities

Winbond Electronics's liabilities constitute the company's financial obligations and debts owed to external parties and stakeholders. They are categorized into current liabilities, due within a year, and long-term liabilities, which are due over a longer period. A detailed assessment of these liabilities is crucial for evaluating Winbond Electronics's financial stability, operational efficiency, and long-term viability.

Year-to-Year Comparison

By comparing Winbond Electronics's liabilities year-over-year, investors can identify trends, shifts, and anomalies in the company’s financial positioning. A decrease in total liabilities often signals financial strengthening, while an increase might indicate enhanced investments, acquisitions, or potential financial strain.

Impact on Investments

Winbond Electronics's total liabilities play a significant role in determining the company's leverage and risk profile. Investors and analysts examine this aspect meticulously to ascertain the firm’s ability to meet its financial obligations, which influences investment attractiveness and credit ratings.

Interpreting Liability Fluctuations

Shifts in Winbond Electronics’s liability structure indicate changes in its financial management and strategy. A reduction in liabilities reflects efficient financial management or debt payoffs, while an increase may suggest expansion, acquisition activities, or accruing operational expenses, each carrying distinct implications for investors.

Frequently Asked Questions about Winbond Electronics stock

The Liabilities of Winbond Electronics is 78.06 B TWD in 2025.

The Liabilities of Winbond Electronics changed from 78.62 B TWD to 78.06 B TWD, representing a -0.72% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of The Liabilities Winbond Electronics since 2006 – with annual values, charts, and detailed analysis.

The Liabilities's TWD is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track The Liabilities's Winbond Electronics historically and in real time.

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Balance Sheet — Winbond Electronics

All Key Metrics — Winbond Electronics