Taiwan IC Packaging

Taiwan IC Packaging Current Liabilities

The Current Liabilities of Taiwan IC Packaging (3372.TWO) as of Oct 29, 2026 is 145.78 M TWD. In the previous year, Current Liabilities was 143.73 M TWD — a change of 1.42% (higher).

Current Liabilities

145.78 MTWD

YoY

1.42%

Last updated:

Current Liabilities of Taiwan IC Packaging is 2025 145.78 M TWD. Current Liabilities of Taiwan IC Packaging was 2024 143.73 M TWD. It decreases by 1.42% higher compared to the previous year.

The Taiwan IC Packaging Current Liabilities history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Current Liabilities
Date
Current Liabilities
Jan 1, 2018
300.11 M TWD
Jan 1, 2019
239.63 M TWD
Jan 1, 2020
328.92 M TWD
Jan 1, 2021
476.80 M TWD
Jan 1, 2022
227.03 M TWD
Jan 1, 2023
225.75 M TWD
Jan 1, 2024
143.73 M TWD
Jan 1, 2025
145.78 M TWD
The Taiwan IC Packaging Current Liabilities history
YEARCurrent LiabilitiesYoY
145.78 MTWD+1.42%
143.73 MTWD-36.33%
225.75 MTWD-0.57%
227.03 MTWD-52.38%
476.80 MTWD+44.96%
328.92 MTWD+37.26%
239.63 MTWD-20.15%
300.11 MTWD-24.21%
395.96 MTWD-16.53%
474.37 MTWD+25.90%
376.77 MTWD-5.15%
397.23 MTWD-1.84%
404.66 MTWD-29.90%
577.28 MTWD-2.07%
589.48 MTWD-21.17%
747.75 MTWD-11.49%
844.78 MTWD+16.67%
724.08 MTWD-24.32%
956.79 MTWD+8.10%
885.13 MTWD+20.47%
734.75 MTWD+32.68%
553.76 MTWD-16.82%
665.73 MTWD+57.72%
422.09 MTWD+55.98%
270.61 MTWD—

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Taiwan IC Packaging Stock analysis

What does Taiwan IC Packaging do? Taiwan IC Packaging Corp. manufactures and packages integrated circuits, focusing on lead frame IC products such as thin small-outline packages (TSOPs), small-outline packages (SOPs), and quad flat packages (QFPs). The company also produces advanced IC packages including thin IC packages and other specialized products. Its clients include manufacturers of consumer electronics, computer peripherals, power management devices, drive components, mobile phones, wireless communication products, IC tags, and memory cards for portable electronics. The firm distributes its products across Taiwan, America, and Asia, serving these key markets with its packaging solutions. The company's revenue streams come from the sale of lead frame IC packaging solutions and advanced IC packages to electronics manufacturers. These products are essential for the production of various end-user devices, particularly in the consumer electronics and mobile communication sectors. Taiwan IC Packaging Corp. targets manufacturers in the consumer electronics, computer peripherals, and mobile phone industries, leveraging its expertise in IC packaging to meet their demand for reliable and efficient components. Operating through its core packaging services, the company serves the demand for integrated circuit packaging in the consumer electronics, computer peripheral, and mobile communication markets. Its product portfolio includes TSOPs, SOPs, QFPs, and thin IC packages, which are used by manufacturers of portable electronic devices. The firm's distribution network spans Taiwan, America, and Asia, ensuring its products reach key manufacturing hubs across these regions. Taiwan IC Packaging is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Taiwan IC Packaging stock

Current Liabilities of Taiwan IC Packaging is 145.78 M TWD in 2025.

Current Liabilities of Taiwan IC Packaging changed from 143.73 M TWD to 145.78 M TWD, representing a 1.42% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Current Liabilities Taiwan IC Packaging since 2006 – with annual values, charts, and detailed analysis.

Current liabilities are obligations due within one year, including accounts payable, short-term debt, and accrued expenses.

Current Liabilities's TWD is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track Current Liabilities's Taiwan IC Packaging historically and in real time.

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Balance Sheet — Taiwan IC Packaging

All Key Metrics — Taiwan IC Packaging