Shenzhen Edadoc Technology Co

Shenzhen Edadoc Technology Co Current Liabilities

The Current Liabilities of Shenzhen Edadoc Technology Co (301366.SZ) as of Nov 3, 2026 is 373.38 M CNY. In the previous year, Current Liabilities was 325.65 M CNY — a change of 14.66% (higher).

Current Liabilities

373.38 MCNY

YoY

14.66%

Last updated:

Current Liabilities of Shenzhen Edadoc Technology Co is 2025 373.38 M CNY. Current Liabilities of Shenzhen Edadoc Technology Co was 2024 325.65 M CNY. It decreases by 14.66% higher compared to the previous year.

The Shenzhen Edadoc Technology Co Current Liabilities history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Current Liabilities
Date
Current Liabilities
Jan 1, 2019
89.92 M CNY
Jan 1, 2020
83.21 M CNY
Jan 1, 2021
174.25 M CNY
Jan 1, 2022
182.15 M CNY
Jan 1, 2023
246.66 M CNY
Jan 1, 2024
325.65 M CNY
Jan 1, 2025
373.38 M CNY
The Shenzhen Edadoc Technology Co Current Liabilities history
YEARCurrent LiabilitiesYoY
373.38 MCNY+14.66%
325.65 MCNY+32.02%
246.66 MCNY+35.42%
182.15 MCNY+4.53%
174.25 MCNY+109.40%
83.21 MCNY-7.46%
89.92 MCNY—

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Shenzhen Edadoc Technology Co Stock analysis

What does Shenzhen Edadoc Technology Co do? Shenzhen Edadoc Technology Co Ltd designs, assembles, and manufactures printed circuit boards, offering one-stop technical support and manufacturing services for product development and hardware innovation. The company provides PCB design services including package building, device layout, rule-driven routing, manufacturability inspection, and result output. PCBA manufacturing services cover welding assembly and raw material supporting services. Its clients operate in industrial control, network communication, integrated circuits, smart transportation, medical electronics, aerospace, and artificial intelligence sectors. The firm's revenue comes from PCB design and PCBA manufacturing services sold to customers in industrial control, network communication, integrated circuits, smart transportation, medical electronics, aerospace, and artificial intelligence industries. These services support product development and hardware innovation across multiple high-tech fields. The company's offerings are tailored to meet the technical requirements of clients in these specialized segments. Edadoc's technical support and manufacturing services are delivered through a comprehensive solution that integrates PCB design with PCBA production. This integrated approach allows the company to serve clients requiring end-to-end manufacturing support for their hardware projects. The services are positioned to address the needs of clients in technology-driven industries seeking reliable and efficient production solutions. Shenzhen Edadoc Technology Co is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Shenzhen Edadoc Technology Co stock

Current Liabilities of Shenzhen Edadoc Technology Co is 373.38 M CNY in 2025.

Current Liabilities of Shenzhen Edadoc Technology Co changed from 325.65 M CNY to 373.38 M CNY, representing a 14.66% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Current Liabilities Shenzhen Edadoc Technology Co since 2006 – with annual values, charts, and detailed analysis.

Current liabilities are obligations due within one year, including accounts payable, short-term debt, and accrued expenses.

Current Liabilities's CNY is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track Current Liabilities's Shenzhen Edadoc Technology Co historically and in real time.

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Balance Sheet — Shenzhen Edadoc Technology Co

All Key Metrics — Shenzhen Edadoc Technology Co