Hongfa Technology Co

Hongfa Technology Co Debt/Market Cap

The Debt to Market Capitalization Ratio of Hongfa Technology Co (600885.SS) as of Oct 23, 2026 is 8.39 %. In the previous year, Debt to Market Capitalization Ratio was 6.38 % — a change of 31.50% (higher).

Debt/Market Cap

8.39 %

YoY

31.50%

Last updated:

Debt to Market Capitalization Ratio of Hongfa Technology Co is 2024 8.39 % . Debt to Market Capitalization Ratio of Hongfa Technology Co was 2023 6.38 % . It decreases by 31.50% higher compared to the previous year.

The Hongfa Technology Co Debt/Market Cap history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Debt/Market Cap
Date
Debt/Market Cap
Jan 1, 2017
2.40 CNY
Jan 1, 2018
3.26 CNY
Jan 1, 2019
4.47 CNY
Jan 1, 2020
3.10 CNY
Jan 1, 2021
4.83 CNY
Jan 1, 2022
5.51 CNY
Jan 1, 2023
6.38 CNY
Jan 1, 2024
8.39 CNY
The Hongfa Technology Co Debt/Market Cap history
YEARDebt/Market CapYoY
8.39 %+31.50%
6.38 %+15.75%
5.51 %+14.28%
4.83 %+55.84%
3.10 %-30.73%
4.47 %+37.26%
3.26 %+35.61%
2.40 %+31.08%
1.83 %+17.19%
1.56 %+34.74%
1.16 %—

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Hongfa Technology Co Stock analysis

What does Hongfa Technology Co do? Hongfa Technology Co., Ltd. generates revenue through the research and development, manufacturing, and sale of relay products, alongside complementary offerings such as low-voltage electrical appliances, high-and low-voltage complete sets of equipment, precision spare parts, sensors, capacitors, and automation equipment. The company serves diverse industries including industrial, energy, transportation, information, life appliances, healthcare, and national security sectors, with products distributed domestically and internationally. Its laboratories for relay detection and analysis support product quality assurance and innovation, enhancing market competitiveness. The firm's primary customers are industrial and energy sector entities requiring relay solutions, alongside businesses in transportation, information technology, healthcare, and national security applications. These segments rely on Hongfa's comprehensive product portfolio for reliable electrical and automation systems, driving consistent demand for its relays and related equipment. The company's domestic and overseas market distribution strategy ensures broad customer reach across multiple industrial applications. Hongfa Technology Co is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Hongfa Technology Co stock

Debt to Market Capitalization Ratio of Hongfa Technology Co is 8.39 % in 2024.

Debt to Market Capitalization Ratio of Hongfa Technology Co changed from 6.38 % to 8.39 %, representing a 31.50% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Debt to Market Capitalization Ratio Hongfa Technology Co since 2006 – with annual values, charts, and detailed analysis.

Debt/Market Cap compares total debt to the market value of equity. It provides a market-based view of financial leverage.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Debt to Market Capitalization Ratio's Hongfa Technology Co with sector peers and the industry average to assess whether it is attractive.

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Leverage — Hongfa Technology Co

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