Flaircomm Microelectronics Current Liabilities
The Current Liabilities of Flaircomm Microelectronics (301600.SZ) as of Jul 25, 2026 is 444.43 M CNY. In the previous year, Current Liabilities was 344.70 M CNY — a change of 28.93% (higher).
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Current Liabilities
444.43 MCNY
YoY
28.93%
Last updated:
Current Liabilities of Flaircomm Microelectronics is 2026 444.43 M CNY. Current Liabilities of Flaircomm Microelectronics was 2025 344.70 M CNY. It decreases by 28.93% higher compared to the previous year.
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Flaircomm Microelectronics Stock analysis
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Current Liabilities of Flaircomm Microelectronics is 444.43 M CNY in 2026.
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Balance Sheet — Flaircomm Microelectronics
Total AssetsCurrent AssetsCash & EquivalentsReceivablesInventoryProperty, Plant & EquipmentGoodwillIntangible AssetsEquityLiabilitiesDebtCurrent LiabilitiesLong-term DebtShort-term DebtRetained EarningsBook Value per ShareTangible Book Value per ShareWorking CapitalInvestmentsAccounts PayableNon-Current AssetsShort-Term InvestmentsLong-Term InvestmentsNet DebtTreasury StockMinority InterestDeferred Tax LiabilitiesNet Tangible AssetsGoodwill/AssetsIntangibles/Assets
All Key Metrics — Flaircomm Microelectronics
Valuation
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Balance Sheet
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- Goodwill
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Profitability
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Leverage
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