ChipMOS Technologies

ChipMOS Technologies Long-term Debt

The Long-Term Debt of ChipMOS Technologies (IMOS) as of Oct 15, 2026 is 309.78 M USD. In the previous year, Long-Term Debt was 327.51 M USD — a change of -5.41% (lower).

Long-term Debt

309.78 MUSD

YoY

-5.41%

Last updated:

Long-Term Debt of ChipMOS Technologies is 2025 309.78 M USD. Long-Term Debt of ChipMOS Technologies was 2024 327.51 M USD. It decreases by -5.41% lower compared to the previous year.

The ChipMOS Technologies Long-term Debt history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Long-term Debt
Date
Long-term Debt
Jan 1, 2018
283.86 M USD
Jan 1, 2019
281.33 M USD
Jan 1, 2020
219.28 M USD
Jan 1, 2021
294.04 M USD
Jan 1, 2022
390.68 M USD
Jan 1, 2023
397.06 M USD
Jan 1, 2024
327.51 M USD
Jan 1, 2025
309.78 M USD
The ChipMOS Technologies Long-term Debt history
YEARLong-term DebtYoY
309.78 MUSD-5.41%
327.51 MUSD-17.52%
397.06 MUSD+1.63%
390.68 MUSD+32.87%
294.04 MUSD+34.09%
219.28 MUSD-22.05%
281.33 MUSD-0.89%
283.86 MUSD+20.29%
235.98 MUSD-22.64%
305.04 MUSD+94.89%
156.52 MUSD+3,355.09%
4.53 MUSD—

Access this data via the Eulerpool API

100,000 free requests/mo · no credit card

ChipMOS Technologies Stock analysis

What does ChipMOS Technologies do? ChipMOS Technologies Inc, listed under the ticker IMOS with ISIN US16965P2020, is a company based in Hsinchu City, Taiwan, operating within the Information Technology sector. The company was founded through an IPO on June 19, 2001, and currently employs 651 people. ChipMOS Technologies engages in the research and development, manufacturing, and sale of integrated circuits, alongside providing related assembly and testing services. Its operations span across Taiwan, Japan, the People's Republic of China, and international markets. The company organizes its business into five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing, Bumping, and Others. It offers a range of leadframe-based packages, including small outline packages, thin small outline packages, and quad flat packages, as well as substrate-based packages such as FBGA, VFBGA, stacked chip-scale packages, TFBGA, LGA, COG, and COF. Additionally, ChipMOS provides testing solutions covering professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot arrangements, engineering support, device failure mode analysis, and automation systems for various IC types including simple digital logic, complex ASIC, high-speed digital, memory, and mixed signal devices. The company also delivers bumping services, intellectual property management, enabling technologies, and turnkey services encompassing wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment for display driver ICs, memory ICs, and logic mix applications. For more information, visit their website at https://www.chipmos.com. ChipMOS Technologies is one of the most popular companies on Eulerpool.

Frequently Asked Questions about ChipMOS Technologies stock

Long-Term Debt of ChipMOS Technologies is 309.78 M USD in 2025.

Long-Term Debt of ChipMOS Technologies changed from 327.51 M USD to 309.78 M USD, representing a -5.41% change. The value is lower than the previous year.

On Eulerpool you can find the complete historical development of Long-Term Debt ChipMOS Technologies since 2006 – with annual values, charts, and detailed analysis.

Long-term debt represents obligations due after one year. It is a key component of a company's capital structure and leverage.

Long-Term Debt's USD is a key factor for investors. Changes in this metric can signal improving or deteriorating fundamentals, directly impacting the stock price. On Eulerpool, you can track Long-Term Debt's ChipMOS Technologies historically and in real time.

Access this data via the Eulerpool API

100,000 free requests/mo · no credit card

Balance Sheet — ChipMOS Technologies

All Key Metrics — ChipMOS Technologies