Advanced Systems Automation

Advanced Systems Automation Debt/EBITDA

The Total Debt to EBITDA Ratio of Advanced Systems Automation (WJ9.SI) as of Oct 30, 2026 is 3.58. In the previous year, Total Debt to EBITDA Ratio was -0.51 — a change of -799.86% (higher).

Debt/EBITDA

3.58

YoY

-799.86%

Last updated:

Total Debt to EBITDA Ratio of Advanced Systems Automation is 2025 3.58 . Total Debt to EBITDA Ratio of Advanced Systems Automation was 2024 -0.51 . It decreases by -799.86% higher compared to the previous year.

The Advanced Systems Automation Debt/EBITDA history

  • 3 Years

  • 10 Years

  • 25 Years

  • Max

Debt/EBITDA
Date
Debt/EBITDA
Jan 1, 2018
-1.37 SGD
Jan 1, 2019
-0.33 SGD
Jan 1, 2020
-0.65 SGD
Jan 1, 2021
3.87 SGD
Jan 1, 2022
5.78 SGD
Jan 1, 2023
-2.97 SGD
Jan 1, 2024
-0.51 SGD
Jan 1, 2025
3.58 SGD
The Advanced Systems Automation Debt/EBITDA history
YEARDebt/EBITDAYoY
3.58-799.86%
-0.51-82.78%
-2.97-151.42%
5.78+49.32%
3.87-700.28%
-0.65+96.67%
-0.33-76.09%
-1.37-26.78%
-1.87+31.75%
-1.42+1,076.65%
-0.12-99.48%
-23.28—

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Advanced Systems Automation Stock analysis

What does Advanced Systems Automation do? Advanced Systems Automation Ltd. generates revenue through its Equipment segment, which designs and manufactures automatic molding machines and back-ended assembly equipment, including the Automolding System E100 Series and Saw Singulation Sort Handler (AS108). The ECMS segment provides precision engineering and fabrication assembly services for semiconductor and non-semiconductor industries, utilizing the company's electromechanical components. Products like the Flip Chip Bonder AFC 8000 and Solder Ball Placement SBP 9300 are sold to manufacturers in semiconductor and healthcare sectors. The firm's integrated line solutions cater to clients requiring comprehensive automation systems. The company's Equipment segment targets semiconductor equipment manufacturers seeking automated molding and assembly solutions, while the ECMS segment serves clients needing precision parts fabrication across semiconductor and non-semiconductor industries. Its electromechanical components are sold to healthcare and scientific industries alongside semiconductor clients. The firm's product portfolio includes specialized machines such as the Solder Ball placement and Saw Singulation and Sort machines, which are integral to semiconductor manufacturing processes. Advanced Systems Automation Ltd. sells its automated equipment and contract manufacturing services directly to industrial clients in the semiconductor industry. The Equipment segment's offerings like the Automolding System E100 Series and Flip Chip Bonder AFC 8000 are key revenue drivers. The ECMS segment's precision engineering services support clients requiring high-accuracy assembly of parts for semiconductor and non-semiconductor applications, with integrated line solutions enhancing customer retention through comprehensive system integration. Advanced Systems Automation is one of the most popular companies on Eulerpool.

Frequently Asked Questions about Advanced Systems Automation stock

Total Debt to EBITDA Ratio of Advanced Systems Automation is 3.58 in 2025.

Total Debt to EBITDA Ratio of Advanced Systems Automation changed from -0.51 to 3.58, representing a -799.86% change. The value is higher than the previous year.

On Eulerpool you can find the complete historical development of Total Debt to EBITDA Ratio Advanced Systems Automation since 2006 – with annual values, charts, and detailed analysis.

Debt/EBITDA measures total debt relative to earnings before interest, taxes, depreciation, and amortization. It indicates the years needed to repay all debt from EBITDA.

A 'good' varies by industry and company stage. On Eulerpool, you can compare Total Debt to EBITDA Ratio's Advanced Systems Automation with sector peers and the industry average to assess whether it is attractive.

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Leverage — Advanced Systems Automation

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